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交換器與多工器
類比交換器與多工器

TMUX1209

現行

具有 1.8-V 輸入邏輯控制的 5-V、4:1、雙通道通用多工器

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產品規格表

TMUX1209

現行
產品規格表 立即訂購

產品詳細資料

Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 42 ON-state leakage current (max) (µA) 0.75 Supply current (typ) (µA) 0.02 Bandwidth (MHz) 125 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 42 ON-state leakage current (max) (µA) 0.75 Supply current (typ) (µA) 0.02 Bandwidth (MHz) 125 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
TSSOP (PW) 16 32 mm² 5 x 6.4 UQFN (RSV) 16 4.68 mm² 2.6 x 1.8
  • Rail to Rail Operation
  • Bidirectional Signal Path
  • Low On-Resistance: 5 Ω
  • Wide Supply Range: 1.08 V to 5.5 V
  • -40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Fail-Safe Logic
  • Low Supply Current: 10 nA
  • Transition Time: 14 ns
  • Break-Before-Make Switching
  • ESD Protection HBM: 2000 V
  • Industry-Standard TSSOP and QFN Packages
  • Rail to Rail Operation
  • Bidirectional Signal Path
  • Low On-Resistance: 5 Ω
  • Wide Supply Range: 1.08 V to 5.5 V
  • -40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Fail-Safe Logic
  • Low Supply Current: 10 nA
  • Transition Time: 14 ns
  • Break-Before-Make Switching
  • ESD Protection HBM: 2000 V
  • Industry-Standard TSSOP and QFN Packages

The TMUX1208 and TMUX1209 are general purpose complementary metal-oxide semiconductor (CMOS) multiplexers (MUX). The TMUX1208 offers 8:1 single-ended channels, while the TMUX1209 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from personal electronics to building automation applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD.

All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX1208 and TMUX1209 are general purpose complementary metal-oxide semiconductor (CMOS) multiplexers (MUX). The TMUX1208 offers 8:1 single-ended channels, while the TMUX1209 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from personal electronics to building automation applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD.

All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
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技術文件

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類型 標題 日期
* Data sheet TMUX1208 5-V Bidirectional 8:1, 1-Channel Multiplexer TMUX1209 5-V Bidirectional 4:1, 2-Channel Multiplexer datasheet (Rev. C) PDF | HTML 2018年 12月 13日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日

設計與開發

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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
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模擬型號

TMUX1209 IBIS Model

SCDM208.ZIP (9 KB) - IBIS Model
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 16 Ultra Librarian
UQFN (RSV) 16 Ultra Librarian
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