產品詳細資料

Package name LGA (PicoStar), SOT-SC70 Peak pulse power (8/20 μs) (max) (W) 0.27 Vrwm (V) 13 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 10 IEC 61000-4-2 contact (±V) 8000 IEC 61000-4-5 (A) 4.5 Clamping voltage (V) 20 Dynamic resistance (typ) 3.5 Interface type Audio Breakdown voltage (min) (V) 14 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -40 to 85
Package name LGA (PicoStar), SOT-SC70 Peak pulse power (8/20 μs) (max) (W) 0.27 Vrwm (V) 13 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 10 IEC 61000-4-2 contact (±V) 8000 IEC 61000-4-5 (A) 4.5 Clamping voltage (V) 20 Dynamic resistance (typ) 3.5 Interface type Audio Breakdown voltage (min) (V) 14 IO leakage current (max) (nA) 50 Rating Catalog Operating temperature range (°C) -40 to 85
PICOSTAR (YFM) 4 0.5929 mm² 0.77 x 0.77 SOT-SC70 (DCK) 3 4.2 mm² 2 x 2.1
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±8-kV IEC 61000-4-2 Contact Discharge
    • ±15-kV IEC 61000-4-2 Air-Gap Discharge
  • IEC 61000-4-5 Surge Protection
    • 4.5-A Peak Pulse Current (8/20-µs Pulse)
  • IO Capacitance 15 pF (Max)
  • Low 50-nA Leakage Current
  • Space-Saving PicoStar™ and SOT Package
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±8-kV IEC 61000-4-2 Contact Discharge
    • ±15-kV IEC 61000-4-2 Air-Gap Discharge
  • IEC 61000-4-5 Surge Protection
    • 4.5-A Peak Pulse Current (8/20-µs Pulse)
  • IO Capacitance 15 pF (Max)
  • Low 50-nA Leakage Current
  • Space-Saving PicoStar™ and SOT Package

This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.

This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.

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類型 標題 日期
* Data sheet TPD2E007 2-Channel ESD Protection Array for AC-Coupled/Negative-Rail Data Interfaces datasheet (Rev. I) PDF | HTML 2016年 3月 22日
Selection guide System-Level ESD Protection Guide (Rev. D) 2022年 9月 7日
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022年 8月 18日
White paper Designing USB for short-to-battery tolerance in automotive environments 2016年 2月 10日
Analog Design Journal Design Considerations for System-Level ESD Circuit Protection 2012年 9月 25日

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開發板

ESDEVM — ESD 評估模組

靜電敏感裝置 (ESD) 評估模組 (EVM) 是我們大多數 ESD 產品組合的開發平台。此電路板配備所有傳統 ESD 元件封裝,可測試任意數量的裝置。裝置可以焊接到其相應的元件封裝上,然後進行測試。對於一般高速 ESD 二極體,會實作阻抗控制的配置以取得 S 參數並取消內嵌電路板軌跡。對於非高速 ESD 二極體,其元件封裝會包含連接至測試點的軌跡,讓您輕鬆執行 DC 測試,例如崩潰電壓、保持電壓、洩漏等。電路板配置也可以透過將訊號針腳短路到訊號所在的任何地方,讓任何裝置針腳都能輕鬆地連接到電源 (VCC) 或接地。
使用指南: PDF | HTML
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
PICOSTAR (YFM) 4 Ultra Librarian
SOT-SC70 (DCK) 3 Ultra Librarian

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