TPD2E007
- IEC 61000-4-2 Level 4 ESD Protection
- ±8-kV IEC 61000-4-2 Contact Discharge
- ±15-kV IEC 61000-4-2 Air-Gap Discharge
- IEC 61000-4-5 Surge Protection
- 4.5-A Peak Pulse Current (8/20-µs Pulse)
- IO Capacitance 15 pF (Max)
- Low 50-nA Leakage Current
- Space-Saving PicoStar™ and SOT Package
This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPD2E007 2-Channel ESD Protection Array for AC-Coupled/Negative-Rail Data Interfaces datasheet (Rev. I) | PDF | HTML | 2016年 3月 22日 |
Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022年 9月 7日 | ||
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022年 8月 18日 | |
White paper | Designing USB for short-to-battery tolerance in automotive environments | 2016年 2月 10日 | ||
Analog Design Journal | Design Considerations for System-Level ESD Circuit Protection | 2012年 9月 25日 |
設計與開發
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ESDEVM — ESD 評估模組
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PICOSTAR (YFM) | 4 | Ultra Librarian |
SOT-SC70 (DCK) | 3 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。