首頁 電源管理 電源保護開關與控制器 eFuse(整合式熱插拔)

TPS7H2201-SEP

現行

耐輻射 1.5V 至 7V 輸入 6A eFuse

產品詳細資料

Vabsmax_cont (V) 7.5 Vin (max) (V) 7 Vin (min) (V) 1.5 Current limit (max) (A) 7.5 Current limit (min) (A) 0.5 Features Current monitoring, Overcurrent protection, Overvoltage protection, Reverse current blocking always, Soft-start, Thermal shutdown Overcurrent response Circuit breaker, Current limiting Fault response Auto-retry Ron (typ) (mΩ) 20 Overvoltage response Cut-off Rating Space Soft start Adjustable Quiescent current (Iq) (typ) (A) 0.0058 Quiescent current (Iq) (max) (A) 0.008 Device type eFuses and hot swap controllers Operating temperature range (°C) -55 to 125
Vabsmax_cont (V) 7.5 Vin (max) (V) 7 Vin (min) (V) 1.5 Current limit (max) (A) 7.5 Current limit (min) (A) 0.5 Features Current monitoring, Overcurrent protection, Overvoltage protection, Reverse current blocking always, Soft-start, Thermal shutdown Overcurrent response Circuit breaker, Current limiting Fault response Auto-retry Ron (typ) (mΩ) 20 Overvoltage response Cut-off Rating Space Soft start Adjustable Quiescent current (Iq) (typ) (A) 0.0058 Quiescent current (Iq) (max) (A) 0.008 Device type eFuses and hot swap controllers Operating temperature range (°C) -55 to 125
HTSSOP (DAP) 32 89.1 mm² 11 x 8.1
  • Standard micro circuit available, SMD 5962R17220
  • Vendor item drawing available, VID V62/23608
  • Radiation performance:
    • Radiation hardness assurance (RHA) up to TID 100krad(Si)
    • Single event latchup (SEL), single event burnout (SEB), and single event gate rupture (SEGR) immune to LET = 75MeV-cm2/mg
    • SEFI/SET characterized to LET = 75MeV-cm2/mg
  • Integrated single channel eFuse
  • Input voltage range: 1.5V to 7V
  • Low on-resistance (RON) of:
    • 35mΩ maximum at 25°C and VIN = 5V for CFP and KGD
    • 23mΩ maximum at 25°C and VIN = 5V for HTSSOP
  • 6A maximum continuous switch current
  • Low control input threshold enables use of 1.2, 1.8, 2.5, and 3.3V logic
  • Configurable rise time (soft start)
  • Reverse current protection
  • Programmable and internal current limiting (fast-trip)
  • Programmable fault timer (current limit and retry modes)
  • Thermal shutdown
  • Ceramic and plastic package with thermal pad
  • Standard micro circuit available, SMD 5962R17220
  • Vendor item drawing available, VID V62/23608
  • Radiation performance:
    • Radiation hardness assurance (RHA) up to TID 100krad(Si)
    • Single event latchup (SEL), single event burnout (SEB), and single event gate rupture (SEGR) immune to LET = 75MeV-cm2/mg
    • SEFI/SET characterized to LET = 75MeV-cm2/mg
  • Integrated single channel eFuse
  • Input voltage range: 1.5V to 7V
  • Low on-resistance (RON) of:
    • 35mΩ maximum at 25°C and VIN = 5V for CFP and KGD
    • 23mΩ maximum at 25°C and VIN = 5V for HTSSOP
  • 6A maximum continuous switch current
  • Low control input threshold enables use of 1.2, 1.8, 2.5, and 3.3V logic
  • Configurable rise time (soft start)
  • Reverse current protection
  • Programmable and internal current limiting (fast-trip)
  • Programmable fault timer (current limit and retry modes)
  • Thermal shutdown
  • Ceramic and plastic package with thermal pad

The TPS7H2201 is a single channel eFuse that provides configurable rise time to minimize inrush current and reverse current protection. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.5V to 7V and can support a maximum continuous current of 6A. The switch is controlled by an on and off input (EN), which is capable of interfacing directly with low-voltage control signals.

The TPS7H2201 is available in a ceramic and plastic package with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –55°C to 125°C.

The TPS7H2201 is a single channel eFuse that provides configurable rise time to minimize inrush current and reverse current protection. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.5V to 7V and can support a maximum continuous current of 6A. The switch is controlled by an on and off input (EN), which is capable of interfacing directly with low-voltage control signals.

The TPS7H2201 is available in a ceramic and plastic package with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –55°C to 125°C.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 10
重要文件 類型 標題 格式選項 日期
* Data sheet TPS7H2201-SP and TPS7H2201-SEP Radiation Hardened 1.5V to 7V, 6A eFuse datasheet (Rev. G) 2025年 12月 2日
* VID TPS7H2201-SEP VID V62-23608 2024年 5月 1日
* Radiation & reliability report TPS7H2201-SEP Production Flow and Reliability Report PDF | HTML 2023年 9月 29日
* Radiation & reliability report TPS7H2201-SEP TID Radiation Report (Rev. A) PDF | HTML 2023年 9月 18日
* Radiation & reliability report TPS7H2201-SEP Neutron Displacement (NDD) Characterization Report PDF | HTML 2023年 8月 29日
* Radiation & reliability report Single Event Effects Report of the TPS7H2201-SEP eFuse and Load Switch PDF | HTML 2023年 8月 24日
Selection guide TI Space Products (Rev. K) 2025年 4月 4日
Certificate TPS7H2201EVM EU Declaration of Conformity (DoC) 2023年 6月 19日
Application note Reduce the Risk in Low-Earth Orbit Missions with Space Enhanced Plastic Products (Rev. A) PDF | HTML 2022年 9月 15日
E-book Radiation Handbook for Electronics (Rev. A) 2019年 5月 21日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TPS7H2201EVM — 適用 1.5-V 至 7-V 輸入、6-A 負載開關/eFuse 的 TPS7H2201 評估模組

TPS7H2201EVM 展示單一 TPS7H2201 eFuse (耐輻射/強化塑膠) 的運作情況。電路板提供可裝入其他元件的元件封裝,以便進行自訂配置測試,例如平行或備援 eFuse。

使用指南: PDF | HTML
TI.com 無法提供
模擬型號

TPS7H2201-SP PSpice Transient Model

SLVMCY9.ZIP (214 KB) - PSpice Model
模擬型號

TPS7H2201-SP Unencrypted PSpice Transient Model (Rev. A)

SLVMCY8A.ZIP (4 KB) - PSpice Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI 是有助於評估類比電路功能的設計和模擬環境。這款全功能設計和模擬套件使用 Cadence® 的類比分析引擎。PSpice for TI 包括業界最大的模型庫之一,涵蓋我們的類比和電源產品組合,以及特定類比行為模型,且使用無需支付費用。

PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。 

在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
封裝 針腳 CAD 符號、佔位空間與 3D 模型
HTSSOP (DAP) 32 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片