產品詳細資料

Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFF) 9 1.96000000000000028000000000000001 mm² 1.4000000000000001 x 1.4000000000000001
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

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類型 標題 日期
* Data sheet AUTONOMOUS AUDIO HEADSET SWITCH, TS3A226AE datasheet (Rev. A) 2013年 7月 24日
Technical article USB Type-C™ power: Should your next device have USB Type-C? PDF | HTML 2017年 2月 14日
Technical article USB Type-C audio: Do I need to buy a new pair of headphones? PDF | HTML 2016年 7月 7日
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 2016年 3月 4日
EVM User's guide TS3A226AE EVM Board User’s Guide (Rev. B) 2013年 8月 13日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

設計與開發

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開發板

TS3A226AEEVM — 適用於自主音訊耳機開關的 TS3A226AE 評估模組

The TS3A226AEEVM is an evaluation module (EVM) for the Texas Instruments (TI) autonomous audio-headset switch. The EVM provides the basic functionality evaluation for theTS3A226AE device and provides peripheral connector for codec signal connection to MICP, TIP and RING1.

The TS3A226AE is an (...)

使用指南: PDF
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模擬型號

TS3A226E HSPICE Model

SCDM156.ZIP (476 KB) - HSpice Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
參考設計

TIDA-03030 — 支援音訊配件的 USB Type-C™ 電源路徑保護參考設計

The TIDA-03030 reference design provides a robust protection solution for the power path in USB Type-C™ applications. The design protects the power path from overvoltage, overcurrent, hot-plug, and reverse-current events by leveraging the TPS25923 (eFuse) and CSD17571Q2 (reverse-blocking (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00006 — 可偵測 3 孔或 4 孔 3.5mm 配件的耳機偵測開關

This reference design is for autonomous audio headset switch applications. Some audio headsets have integrated analog microphones. The GND and MIC connections on the audio jack connector may be swapped depending on the manufacturer. This design has the ability to detect the presence of an analog (...)
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YFF) 9 Ultra Librarian

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