TS3A4741
- Low ON-State Resistance (Ron)
- 0.9-Ω Max (3-V Supply)
- 1.5-Ω Max (1.8-V Supply)
- 0.4-Ω Max Ron Flatness (3-V Supply)
- 1.6-V to 3.6-V Single-Supply Operation
- Available in SOT-23 and VSSOP Packages
- High Current-Handling Capacity (100 mA
Continuous) - 1.8-V CMOS Logic Compatible (3-V Supply)
- Fast Switching: tON = 14 ns, tOFF = 9 ns
The TS3A4741 and TS3A4742 are bi-directional, 2-channel single-pole/single-throw (SPST) analog switches with low ON-state resistance (Ron), low-voltage, that operate from a single 1.6-V to 3.6-V supply. These devices have fast switching speeds, handle rail-to-rail analog signals, and consume very low quiescent power.
The digital logic input is 1.8-V CMOS compatible when using a single 3-V supply.
The TS3A4741 has two normally open (NO) switches, and the TS3A4742 has two normally closed (NC) switches.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TS3A474x 0.9-Ω Low-Voltage Single-Supply 2-Channel SPST Analog Switches datasheet (Rev. F) | PDF | HTML | 2015年 12月 3日 |
Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 2022年 7月 26日 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DCN) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。