產品詳細資料

Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 COFF (typ) (pF) 70 CON (typ) (pF) 370 Off isolation (typ) (dB) -68 OFF-state leakage current (max) (µA) 0.375 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.15 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 COFF (typ) (pF) 70 CON (typ) (pF) 370 Off isolation (typ) (dB) -68 OFF-state leakage current (max) (µA) 0.375 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.15 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
DSBGA (YZP) 10 2.8125 mm² 2.25 x 1.25 VSON (DRC) 10 9 mm² 3 x 3 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Specified break-before-make switching
  • Negative signaling capability: maximum swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Low ON-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent ON-state resistance matching
  • 2.3-V to 5.5-V Power supply (VCC)
  • Latch-Up performance exceeds 100 mA Per JESD 78, Class II
  • ESD Performance tested per JESD 22
    • 2500-V Human-body model
      (A114-B, class II)
    • 1500-V Charged-device model (C101)
    • 200-V Machine model (A115-A)
  • Specified break-before-make switching
  • Negative signaling capability: maximum swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Low ON-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent ON-state resistance matching
  • 2.3-V to 5.5-V Power supply (VCC)
  • Latch-Up performance exceeds 100 mA Per JESD 78, Class II
  • ESD Performance tested per JESD 22
    • 2500-V Human-body model
      (A114-B, class II)
    • 1500-V Charged-device model (C101)
    • 200-V Machine model (A115-A)

The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00 mm × 3.00 mm DRC package is also available as a nonmagnetic package for medical imaging application.

The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00 mm × 3.00 mm DRC package is also available as a nonmagnetic package for medical imaging application.

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類型 標題 日期
* Data sheet TS5A22362 0.65-Ω 2-channel SPDT Analog Switches With Negative Signaling Capability datasheet (Rev. E) PDF | HTML 2019年 9月 25日
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 2022年 7月 26日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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模擬型號

HSPICE Model for TS5A22362

SCDM121.ZIP (105 KB) - HSpice Model
模擬型號

TS5A22362 IBIS Model

SCDM120.ZIP (68 KB) - IBIS Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YZP) 10 Ultra Librarian
VSON (DRC) 10 Ultra Librarian
VSSOP (DGS) 10 Ultra Librarian

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