TS5A63157
- Overshoot and Undershoot Voltage Protection
- Isolation in Powered-Off Mode, V+ = 0 V
- Specified Break-Before-Make Switching
- Low ON-State Resistance (12 Ω)
- Control Inputs Are 5-V Tolerant
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 1.65-V to 5.5-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
The TS5A63157 is a single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. Signals up to V+ (peak) can be transmitted in either direction.
TI has integrated overshoot and undershoot protection circuitry. The TS5A63157 senses overshoot and undershoot events at the I/Os and responds by preventing voltage differentials from developing and turning the switch on.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TS5A63157 12-Ω SPDT analog switch 5-V/3.3-V single-channel 2:1 multiplexer/demultiplexer datasheet (Rev. B) | PDF | HTML | 2019年 3月 21日 |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021年 1月 6日 | |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
TIDM-ULTRASONIC-WATER-FLOW-MEASUREMENT — 超音波水流測量參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 6 | Ultra Librarian |
SOT-SC70 (DCK) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。