TUSB1104
- USB 3.2 5Gbps and 10Gbps support
- USB 3.2 x2 support up to 20Gbps (10Gbps × 2 = 20Gbps)
- Advanced USB power management
- Active: 550mW (typical)
- Disconnect: 1.5mW
- Disabled (EN = L): 0.130mW
- 16 EQ settings up to 12dB at 5GHz
- Choice between adaptive or fixed receiver equalization for ports facing USB connector
- Choice between linear or limited redriver for ports facing the system (SSRX1/2 transmitters)
- Less than 1V VTX-CM and VRX-CM
- Configuration through I2C or pin-strap
- Selection between 1.8V or 3.3V I2C levels
- Operates from a single 3.3V supply
The TUSB1104 is a 10Gbps USB 3.2 x2 linear redriver for USB-C applications enabling up to 20Gbps total data throughput. The TUSB1104 is intended to reside between a Host and a USB-C receptacle or between a USB device and a USB-C receptacle. The TUSB1104 supports both USB 3.2 Gen2 (10Gbps) and Gen1 (5Gbps) as well as USB 3.2 low power states (Disconnect, U1, U2, and U3).
The TUSB1104 incorporates an adaptive receiver equalization (AEQ) feature. The AEQ feature automatically determines what the best ISI compensation settings are between the TUSB1104 and USB device plugged into the USB connector resulting in improved interoperability.
The TUSB1104 operates from a single 3.3V supply and is available in a 40-pin WQFN package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TUSB1104 USB Type-C 10Gbps USB 3.2 x2 Adaptive Linear Redriver datasheet (Rev. A) | PDF | HTML | 2024年 5月 31日 |
Application note | USB 3.2 Dual Lane Operation: What You Need to Know | PDF | HTML | 2023年 10月 25日 | |
EVM User's guide | TUSB1104 EVM User's Guide | PDF | HTML | 2022年 4月 7日 | |
Certificate | TUSB1104EVM EU RoHS Declaration of Conformity (DoC) | 2022年 4月 1日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TUSB1104EVM — TUBS1104 USB 3.2 superspeed+ x2 訊號調節器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-010248 — USB Type-C® 電力輸送和訊號調節器參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RNQ) | 40 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。