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LM140LAH-12/883 ACTIVE

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Rating

Military
RoHS No
REACH Affected
Device Marking LM140LAH-12/883 Q ACO, LM140LAH-12/883 Q >T
Lead finish/Ball material —
MSL rating/Peak reflow Level-1-NA-UNLIM

MTBF/FIT estimates

MTBF/FIT MTBF/FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy (eV) Test temp (°C) Test duration (hours) Sample size Fails Additional comments
4.53x108 2.2 55 60 0.7 125 1000 5296 0 —

Material content

Homogeneous material level Component level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Aluminum and Its Alloys
Aluminum
7429-90-5
0.010921
100.000000
1000000
0.001089
11
Sub-total
— —
0.010921
100
1000000
0.001089
11
Die Attach Adhesive
Precious Metals
Gold
7440-57-5
0.84546
100.000000
1000000
0.084318
843
Sub-total
— —
0.84546
100
1000000
0.084318
843
Header - Eyelet
Copper and Its Alloys
Iron
7439-89-6
315.522
54.000000
540000
31.467238
314672
Nickel and Its Alloys
Nickel
7440-02-0
169.447
29.000000
290000
16.899072
168991
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
99.331
17.000000
170000
9.906353
99064
Sub-total
— —
584.300
100
1000000
58.272663
582727
Header - Glass
Other Inorganic Materials
Aluminum Oxide
1344-28-1
0.954
9.000000
90000
0.095143
951
Other Inorganic Materials
Lithium Oxide
12057-24-8
0.212
2.000000
20000
0.021143
211
Other Inorganic Materials
Potassium Oxide
12136-45-7
0.318
3.000000
30000
0.031714
317
Other Inorganic Materials
Silicon Dioxide
7631-86-9
8.586
81.000000
810000
0.856288
8563
Other Nonferrous Metals and Alloys
Barium Oxide
1304-28-5
0.318
3.000000
30000
0.031714
317
Other Nonferrous Metals and Alloys
Sodium Oxide
1313-59-3
0.212
2.000000
20000
0.021143
211
Sub-total
— —
10.600
100
1000000
1.057146
10571
Header - Pin
Copper and Its Alloys
Iron
7439-89-6
35.208
54.000000
540000
3.511319
35113
Nickel and Its Alloys
Nickel
7440-02-0
18.908
29.000000
290000
1.885709
18857
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
11.084
17.000000
170000
1.105415
11054
Sub-total
— —
65.200
100
1000000
6.502443
65024
Header - Plating
Nickel and Its Alloys
Nickel
7440-02-0
13.42
49.703704
497037
1.338386
13384
Other Nonferrous Metals and Alloys
Lead
7439-92-1
1.85
6.851852
68519
0.184502
1845
Other Nonferrous Metals and Alloys
Tin
7440-31-5
3.15
11.666667
116667
0.314152
3142
Precious Metals
Gold
7440-57-5
8.58
31.777778
317778
0.855690
8557
Sub-total
— —
27.00
100
1000000
2.692730
26927
Lid
Copper and Its Alloys
Copper
7440-50-8
0.09426
0.030000
300
0.009401
94
Nickel and Its Alloys
Nickel
7440-02-0
312.50332
99.460000
994600
31.166183
311662
Other Inorganic Materials
Silicon
7440-21-3
0.433596
0.138000
1380
0.043243
432
Other Nonferrous Metals and Alloys
Cobalt
7440-48-4
0.072266
0.023000
230
0.007207
72
Other Nonferrous Metals and Alloys
Manganese
7439-96-5
0.700666
0.223000
2230
0.069878
699
Other Nonferrous Metals and Alloys
Titanium
7440-32-6
0.223082
0.071000
710
0.022248
222
Other Plastics and Rubber
Carbon
7440-44-0
0.17281
0.055000
550
0.017234
172
Sub-total
— —
314.200000
100
1000000
31.335394
313354
Semiconductor Device
Ceramics / Glass
Doped Silicon
7440-21-3
0.543636
100.000000
1000000
0.054217
542
Sub-total
— —
0.543636
100
1000000
0.054217
542
Total
— —
1002.700017
— —
100
1000000

Qualification summary

No results found

Ongoing reliability monitoring

FAB process reliability data
Fab Process Reliability Test Rolling Year (1Q2025 - 4Q2025) Sample Size Cumulative Sample Size Disposition
BIPOLAR Life test 125C, 1000 Hours or Equivalent JEDEC Condition 1155 24461 Pass
Assembly process reliability data
Package Family Reliability Test Rolling Year (1Q2025 - 4Q2025) Sample Size Cumulative Sample Size Disposition
TO Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition 446 12167 Pass
TO High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition 609 7954 Pass
TO Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition 1220 21180 Pass
TO Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition 700 17955 Pass

Additional resources

General quality guidelines

Certifications

Conflict minerals specialized disclosure report

For additional information, please contact TI customer support center.

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Data-type definitions

RoHS

TI products are designated as “RoHS Compliant” when designated RoHS = Yes, or RoHS = Exempt, to comply with EU Directive 2011/65/EU (entered July 21, 2011) and the amended Directive (EU) 2015/863 (effective July 22, 2019) for Restriction of the Use of Hazardous Substances (“RoHS”).

To the best of TI’s knowledge, TI products that are declared as RoHS Compliant

• Do not contain restricted substances above the RoHS maximum allowed threshold values,

OR

• Where applicable, may be subject to one of the RoHS Annex III exemptions for lead (Pb), as documented in "TI RoHS Statement" for more details.

REACH

Yes: Fully compliant to the European Union (EU) RoHS, no exemption required.

Affected: Only used for Regulation for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) substance of very high concern (SVHC) substances when contained above the threshold. REACH SVHCs are not restricted from use, but if contained above the threshold, further information must be available.

No: Not compliant to EU RoHS.

Please see the "TI REACH Statement" for more details.

Device Marking

Package top marking

Lead finish/Ball material

Lead finish and solder-ball composition

MSL rating/Peak reflow

Moisture sensitivity level (MSL) is a Joint Electron Device Engineering Council (JEDEC) industry standard classification that defines the length of time products can be safely exposed to an ambient environment before high-temperature reflow soldering.

MTBF/FIT estimates

The purpose of this qualification testing is to determine the life of a product and show conditions under which the rates were derived.

Material content

TI bases its material content information on information provided by third-party suppliers. TI takes reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and its suppliers may consider certain information proprietary, and thus may not be able make certain information available for release. The material content information is provided by TI “as is.”

Qualification summary

Quality and reliability are built into TI’s culture, with the goal of providing customers high-quality products. TI develops its semiconductor technologies with a minimum goal of fewer than 50 failures in time (FIT) at 100,000 power-on hours at a 105°C junction temperature. TI builds simulations, accelerated testing and robustness evaluations into its product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability and silicon/package interaction.

Ongoing reliability monitoring

The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.