DEYAN-3P-MSPM0-KIT

This is the minimum system of MSPM0L1306 packaged with QFN32 of the L series maximum resource of TI MSPM0+. The board integrates USB to UART. It can support BSL directly write MCU, which can reduce the development cost; The LDO chip is integrated on the board to supply power to MCU and external baseplate. At the same time, the board integrates a user key and a user LED, expands all GPIO, and independently expands SWD interface, supports TI XDS emulator and JLINK for simulation and download programs. 

On the MSPM0+ expansion baseboard, common peripherals which  found on MCU evaluation boards are integrated, such as OLED display with integrated I2C interface, independent nititube and scanning nititube, EEPROM, SPI, FLASH, buzzer, RS485, etc. 

For the excellent ADC and OPA performance of the MSPM0L series, the board integrated analog peripherals such as photodiodes and temperature sensors. It also integrated an infrared LED and an infrared PD, which are provided for engineers who need to evaluate the accuracy of the ADC to test its performance. 

In order to improve the flexibility of using, the peripheral interfaces of MSPM0+ expansion baseboard are used in pin row mode, so that users can use dupont wire to connect the core board, and are able to modify the interface connection mode, thereby improving the application mode of the expansion baseboard.

Arm Cortex-M0+ MCUs