SURFACE-MOUNT-ADAPTER-EVM

The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options:

D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF).

QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG).

SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE).

TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE).

Features

Comparators