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SIMPLELINK-CC13XX-CC26XX-SDK
SimpleLink™ CC13xx and CC26xx software development kit (SDK)
製品
低消費電力 2.4GHz 製品
Sub-1GHz ワイヤレス・マイコン
車載ワイヤレス接続製品
ハードウェア開発
評価ボード
開発キット
リリース情報
The SimpleLink™ CC13xx and CC26xx Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack , TI Wi-SUN FAN, as well as the TI-RTOS kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
最新情報
- Added support for CC1312PSIP
- TI has finalized migration and support for the new TI-RTOS 7 kernel on all our wireless stacks. For more information, look for the TI-RTOS7 User's Guide
- Removed EasyLink examples. Customers developing a proprietary solution are encouraged to start with our Proprietary RF examples.
- Preliminary release for CC13x4/CC26x4 devices. Full feature support will be included in 1H 2023.