SBAS561C June   2012  – January 2017 ADS131E04 , ADS131E06 , ADS131E08

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Noise Measurements
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Electromagnetic Interference (EMI) Filter
      2. 9.3.2  Input Multiplexer
        1. 9.3.2.1 Device Noise Measurements
        2. 9.3.2.2 Test Signals (TestP and TestN)
        3. 9.3.2.3 Temperature Sensor (TempP, TempN)
        4. 9.3.2.4 Power-Supply Measurements (MVDDP, MVDDN)
      3. 9.3.3  Analog Input
      4. 9.3.4  PGA Settings and Input Range
        1. 9.3.4.1 Input Common-Mode Range
      5. 9.3.5  ΔΣ Modulator
      6. 9.3.6  Clock
      7. 9.3.7  Digital Decimation Filter
      8. 9.3.8  Voltage Reference
      9. 9.3.9  Input Out-of-Range Detection
      10. 9.3.10 General-Purpose Digital I/O (GPIO)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Start
        1. 9.4.1.1 Settling Time
        2. 9.4.1.2 Input Signal Step
      2. 9.4.2 Reset (RESET)
      3. 9.4.3 Power-Down (PWDN)
      4. 9.4.4 Continuous Conversion Mode
      5. 9.4.5 Data Retrieval
        1. 9.4.5.1 Data Ready (DRDY)
        2. 9.4.5.2 Reading Back Data
        3. 9.4.5.3 Status Word
        4. 9.4.5.4 Readback Length
    5. 9.5 Programming
      1. 9.5.1 Data Format
      2. 9.5.2 SPI Interface
        1. 9.5.2.1 Chip Select (CS)
        2. 9.5.2.2 Serial Clock (SCLK)
        3. 9.5.2.3 Data Input (DIN)
        4. 9.5.2.4 Data Output (DOUT)
      3. 9.5.3 SPI Command Definitions
        1. 9.5.3.1  Sending Multibyte Commands
        2. 9.5.3.2  WAKEUP: Exit STANDBY Mode
        3. 9.5.3.3  STANDBY: Enter STANDBY Mode
        4. 9.5.3.4  RESET: Reset Registers to Default Values
        5. 9.5.3.5  START: Start Conversions
        6. 9.5.3.6  STOP: Stop Conversions
        7. 9.5.3.7  OFFSETCAL: Channel Offset Calibration
        8. 9.5.3.8  RDATAC: Start Read Data Continuous Mode
        9. 9.5.3.9  SDATAC: Stop Read Data Continuous Mode
        10. 9.5.3.10 RDATA: Read Data
        11. 9.5.3.11 RREG: Read from Register
        12. 9.5.3.12 WREG: Write to Register
    6. 9.6 Register Map
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1 ID: ID Control Register (Factory-Programmed, Read-Only) (address = 00h) [reset = xxh]
        2. 9.6.1.2 CONFIG1: Configuration Register 1 (address = 01h) [reset = 91h]
        3. 9.6.1.3 CONFIG2: Configuration Register 2 (address = 02h) [reset = E0h]
        4. 9.6.1.4 CONFIG3: Configuration Register 3 (address = 03h) [reset = 40]
        5. 9.6.1.5 FAULT: Fault Detect Control Register (address = 04h) [reset = 00h]
        6. 9.6.1.6 CHnSET: Individual Channel Settings (address = 05h to 0Ch) [reset = 10h]
        7. 9.6.1.7 FAULT_STATP: Fault Detect Positive Input Status (address = 12h) [reset = 00h]
        8. 9.6.1.8 FAULT_STATN: Fault Detect Negative Input Status (address = 13h) [reset = 00h]
        9. 9.6.1.9 GPIO: General-Purpose IO Register (address = 14h) [reset = 0Fh]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Setting the Device Up for Basic Data Capture
      3. 10.1.3 Multiple Device Configuration
        1. 10.1.3.1 Synchronizing Multiple Devices
        2. 10.1.3.2 Standard Configuration
        3. 10.1.3.3 Daisy-Chain Configuration
      4. 10.1.4 Power Monitoring Specific Applications
      5. 10.1.5 Current Sensing
      6. 10.1.6 Voltage Sensing
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Up Timing
    2. 11.2 Recommended External Capacitor Values
    3. 11.3 Device Connections for Unipolar Power Supplies
    4. 11.4 Device Connections for Bipolar Power Supplies
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resource
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

Application Information

Unused Inputs and Outputs

Power down unused analog inputs and connect them directly to AVDD.

Power down the Bias amplifier if unused and float OPAMPOUT and OPAMPN. Tie OPAMPP directly to AVSS or leave floating if unused.

Tie TESTN and TESTP to AVDD through individual 10-kΩ resistors or leave them floating if unused and the internal test signal is not used. If the internal test signal is used, leave TESTP and TESTN floating. If an external test signal is used, connect to external test circuitry.

Do not float unused digital inputs because excessive power-supply leakage current might result. Set the two-state mode setting pins high to DVDD or low to DGND through ≥10-kΩ resistors.

Pull DRDY to supply using weak pull-up resistor if unused.

If not daisy-chaining devices, tie DAISYIN directly to DGND.

Setting the Device Up for Basic Data Capture

This section outlines the procedure to configure the device in a basic state and capture data. This procedure is intended to put the device in a data sheet condition to check if the device is working properly in the user system. It is recommended that this procedure be followed initially to get familiar with the device settings. When this procedure is verified, the device can be configured as needed. For details on the timings for commands refer to the appropriate sections in the data sheet. The flow chart of Figure 53 details the initial ADS131E0x configuration and setup.

ADS131E04 ADS131E06 ADS131E08 ai_flow_bas561.gif Figure 53. Initial Flow at Power Up

Multiple Device Configuration

The ADS131E0x provides configuration flexibility when multiple devices are used in a system. The serial interface typically needs four signals: DIN, DOUT, SCLK, and CS. With one additional chip select signal per device, multiple devices can be operated on the same SPI bus. The number of signals needed to interface to N devices is 3 + N.

Synchronizing Multiple Devices

When using multiple devices, the devices can be synchronized using the START signal. The delay time from the rising edge of the START signal to the falling edge of the DRDY signal is fixed for a given data rate (see the Start section for more details on the settling times). Figure 54 shows the behavior of two devices when synchronized with the START signal.

ADS131E04 ADS131E06 ADS131E08 ai_tim_sync_multi_sbas705.gif Figure 54. Synchronizing Multiple Converters

To use the internal oscillator in a daisy-chain configuration, one device must be set as the master for the clock source with the internal oscillator enabled (CLKSEL pin = 1) and the internal oscillator clock must be brought out of the device by setting the CLK_EN register bit to 1. The master device clock is used as the external clock source for the other devices.

There are two ways to connect multiple devices with an optimal number of interface pins: standard configuration and daisy-chain configuration.

Standard Configuration

Figure 55a shows a configuration with two ADS131E0x devices cascaded. Together, the devices create a system with up to 16 channels. DOUT, SCLK, and DIN are shared. Each device has its own chip select. When a device is not selected by the corresponding CS being driven to logic 1, the DOUT pin of this device is high-impedance. This structure allows the other device to take control of the DOUT bus. This configuration method is suitable for the majority of applications where extra I/O pins are available.

Daisy-Chain Configuration

Daisy-chain mode is enabled by setting the DAISY_IN bit in the CONFIG1 register. Figure 55b shows the daisy-chain configuration. In this mode SCLK, DIN, and CS are shared across multiple devices. The DOUT pin of device 1 is connected to the DAISY_IN pin of device 0, thereby creating a daisy-chain for the data. Connect the DAISY_IN pin of device 1 to DGND if not used. The daisy-chain timing requirements for the SPI interface are illustrated in Figure 2. Data from the ADS131E0x device 0 appear first on DOUT, followed by a don’t care bit, and then the status and data words from the ADS131E0x device 1.

The internal oscillator output cannot be enabled because all devices in the chain operate by sharing the same DIN pin, thus an external clock must be used.

ADS131E04 ADS131E06 ADS131E08 ai_daisy_connex_sbas705.gif
To reduce pin count, set the START pin low and use the START command to synchronize and start conversions.
Figure 55. Multiple Device Configurations

There are several items to be aware of when using daisy-chain mode:

  1. One extra SCLK must be issued between each data set (see Figure 56)
  2. All devices are configured to the same register values because the CS signal is shared
  3. Device register readback is only valid for device 0 in the daisy-chain. Only ADC conversion data can be read back from device 1 through device N, where N is the last device in the chain.

The more devices in the chain, the more challenging adhering to setup and hold times becomes. A star-pattern connection of SCLK to all devices, minimizing the trace length of DOUT, and other printed circuit board (PCB) layout techniques helps to mitigate this challenge with signal delays. Placing delay circuits (such as buffers) between DOUT and DAISY_IN are options to help reduce signal delays. One other option is to insert a D flip-flop between DOUT and DAISY_IN clocked on an inverted SCLK. Figure 56 shows a timing diagram for daisy-chain mode.

ADS131E04 ADS131E06 ADS131E08 ai_tim_daisy_bas561.gif

NOTE:

n = (number of channels) × (resolution) + 24 bits. The number of channels is 8. Resolution is 16 bits or 24 bits.
Figure 56. Daisy-Chain Data Word

The maximum number of devices that can be daisy-chained depends on the data rate that the devices are operated at. The maximum number of devices can be calculated with Equation 10.

Equation 10. ADS131E04 ADS131E06 ADS131E08 q_ndevices_bas561.gif

where

  • NBITS = device resolution (depends on DR[2:0] setting)
  • NCHANNELS = number of channels powered up in the device

For example, when the ADS131E0x is operated in 24-bit, 8-kSPS data rate with fSCLK = 10 MHz, up to six devices can be daisy-chained together.

Power Monitoring Specific Applications

All channels of the ADS131E0x are exactly identical, yet independently configurable, thus giving the user the flexibility of selecting any channel for voltage or current monitoring. An overview of a system configured to monitor voltage and current is illustrated in Figure 57. Also, the simultaneously sampling capability of the device allows the user to monitor both the current and the voltage at the same time. The full-scale differential input voltage of each channel is determined by the PGA gain setting (see the CHnSET: Individual Channel Settings section) for the respective channel and VREF (see the CONFIG3: Configuration Register 3 section).

ADS131E04 ADS131E06 ADS131E08 ai_oview_pwr_monitor_bas561.gif Figure 57. Overview of a Power-Monitoring System

Current Sensing

Figure 58 illustrates a simplified diagram of typical configurations used for current sensing with a Rogowski coil, current transformer (CT), or an air coil that outputs a current or voltage. In the case of a current output transformer, the burden resistors (R1) are used for current-to-voltage conversion. The output of the burden resistors is connected to the ADS131E0x INxP and INxN inputs through an antialiasing RC filter for current sensing. In the case of a voltage output transformer for current sensing (such as certain types of Rogowski coils), the output terminals of the transformer are directly connected to the ADS131E0x INxP and INxN inputs through an antialiasing RC filter. The input network must be biased to mid-supply if using a unipolar-supply analog configuration (AVSS = 0 V, AVDD = 2.7 V to 5.5 V). The common-mode bias voltage [(AVDD + AVSS) / 2] can be obtained from the ADS131E0x by either configuring the internal op amp in a unity-gain configuration using the RF resistor and setting the OPAMP_REF bit of the CONFIG3 register to 1, or generated externally with a resistor divider network between the positive and negative supplies.

Select the value of resistor R1 for the current output transformer and turns ratio of the transformer such that the ADS131E0x full-scale differential input voltage range is not exceeded. Likewise, select the output voltage for the voltage output transformer to not exceed the full-scale differential input voltage range. In addition, the selection of the resistors (R1 and R2) and turns ratio must not saturate the transformer over the full operating dynamic range. Figure 58a illustrates differential input current sensing and Figure 58b illustrates single-ended input voltage sensing. Use separate external op amps to source and sink current because the internal op amp has very limited current sink and source capability. Additionally, separate op amps for each channel help isolate individual phases from one another to limit crosstalk.

Voltage Sensing

Figure 59 illustrates a simplified diagram of commonly-used differential and single-ended methods of voltage sensing. A resistor divider network is used to step down the line voltage to within the acceptable ADS131E0x input range and then connect to the inputs (INxP and INxN) through an antialiasing RC filter formed by resistor R3 and capacitor C. The common-mode bias voltage [(AVDD + AVSS) / 2] can be obtained from the ADS131E0x by either configuring the internal op amp in a unity-gain configuration using the RF resistor and setting the OPAMP_REF bit of the CONFIG3 register, or generated externally by using a resistor divider network between the positive and negative supplies.

In either of the cases illustrated in Figure 59 (Figure 59a for a differential input and Figure 59b for a single-ended input), the line voltage is divided down by a factor of [R2 / (R1 + R2)]. Values of R1 and R2 must be carefully chosen so that the voltage across the ADS131E0x inputs (INxP and INxN) does not exceed the range of the ADS131E0x over the full operating dynamic range. Use separate external op amps to source and sink current because the internal op amp has very limited current sink and source capability. Additionally, separate op amps for each channel help isolate individual phases from one another to limit crosstalk.

ADS131E04 ADS131E06 ADS131E08 ai_simple_isense_conex_bas705.gif Figure 58. Simplified Current-Sensing Connections
ADS131E04 ADS131E06 ADS131E08 ai_simple_vsense_conex_bas705.gif Figure 59. Simplified Voltage-Sensing Connections

Typical Application

Figure 60 shows the ADS131E0x being used as part of an electronic trip unit (ETU) in a circuit breaker or protection relay. Delta-sigma (ΔΣ), analog-to-digital converters (ADCs), such as the ADS131E0x, are ideal for this application because these devices provide a wide dynamic range.

The system measures voltages and currents output from a breaker enclosure. In this example, the first three inputs measure line voltage and the remaining five inputs measure line current from the secondary winding of a current transformer (CT). A voltage divider steps down the voltage from the output of the breaker. Several resistors are used to break up power consumption and are used as a form of fault protection against any potential resistor short-circuit. After the voltage step down, RC filters are used for antialiasing and diodes protect the inputs from overrange.

ADS131E04 ADS131E06 ADS131E08 apps_schematic_sbas705.gif Figure 60. ETU Block Diagram: High-Resolution and Fast Power-Up Analog Front-End for Air Circuit Breaker or Molded Case Circuit Breaker and Protection Relay

Design Requirements

Table 21 summarizes the design requirements for the circuit breaker front-end application.

Table 21. ETU Circuit Breaker Design Requirements

DESIGN PARAMETER VALUE
Number of voltage inputs 3
Voltage input range 10 V to 750 V
Number of current inputs 5
Current input range 50 mA to 25 A
Dynamic range with fixed gain > 500:1
Accuracy ±1%

Detailed Design Procedure

The line voltage is stepped down to a voltage range within the measurable range of the ADC. The reference voltage determines the range in which the ADC can measure signals. The ADS131E0x has two integrated low-drift reference voltage options: 2.4 V and 4 V.

Equation 11 describes the transfer function for the voltage divider at the input in Figure 60. Using multiple series resistors, RDIV1, and multiple parallel resistors, RDIV2, allows for power and heat to be dissipated among several circuit elements and serves as protection against a potential short-circuit across a single resistor. The number of resistors trade off with nominal accuracy because each additional element introduces an additional source of tolerance.

Equation 11. ADS131E04 ADS131E06 ADS131E08 eq_apps_Vdiv_sbas705.gif

The step-down resistor, RDiv2, dominates the measurement error produced by the resistor network. Using input PGAs on the ADS131E0x helps to mitigate this error source by allowing RDiv2 to be made smaller and then amplifying the signal to near full-scale using the ADS131E0x PGA.

For this design, RDiv1 is set to 200 kΩ and RDiv2 is set to 2.4 kΩ to provide proper signal attenuation at a sufficient power level across each resistor. The input saturates at values greater than ±750 V when using the ADS131E0x internal 2.4-V reference and a PGA gain of 2.

The ADS131E0x measures the line current by creating a voltage across the burden resistance (RBurden in Figure 60) in parallel with the secondary winding of a CT. As with the voltage measurement front-end, multiple resistors (RDiv1) that are used to step down a voltage share the duty of dissipating power. In this design, RBURDEN is set to 33 Ω. Used with a 1:500 turns ratio CT, the ADC input saturates with a line current over 25 A when the ADC is configured using the internal 2.4-V reference and a PGA gain of 2.

Diodes protect the ADS131E0x inputs from overvoltage and current. Diodes on each input shunt to either supply if the input voltage exceeds the safe range for the device. On current inputs, a diode shunts the inputs if current on the secondary winding of the CT threatens to damage the device.

The combination of RFilt, CCom, and CDif form the antialiasing filters for each of the inputs. The differential capacitor CDif improves the common-mode rejection of the system by sharing its tolerance between the positive and negative input. The antialiasing filter requirement is not strict because the nature of a ΔΣ converter (with oversampling and digital filter) attenuates a significant proportion of out-of-band noise. In addition, the input PGAs have intentionally low bandwidth to provide additional antialiasing. The component values used in this design are RFilt = 1 kΩ, CCom = 47 pF, and CDif = 0.015 μF. This first-order filter produces a relatively flat frequency response beyond 2 kHz, capable of measuring greater than 30 harmonics at a 50-Hz or 60-Hz fundamental frequency. The 3-dB cutoff frequency of the filter is 5.3 kHz for each input channel.

Each analog system block introduces errors from input to output. Protection CTs in the 5P accuracy class can introduce as much as ±1% current error from input to output. CTs in the 10P accuracy class can introduce as much as ±3% error. The burden resistor also introduces errors in the form of resistor tolerance and temperature drift. For the voltage input, error comes from the divider network in the form of resistor tolerance and temperature drift. Finally, the converter introduces errors in the form of offset error, gain error, and reference error. All of these specifications can drift over temperature.

Application Curves

Accuracy is measured using a system designed in a similar way to that illustrated in Figure 60. The CT used for the current input is CT1231 (a 0.3 class, solid core, 5:2500 turns transformer). In each case, data are taken for three channels over one cycle of the measured waveform and the RMS input-referred signal is compared to the output to calculate the error. The equation used to derive the measurement error is shown in Equation 12. Data are taken using both the 2.4-V and 4-V internal reference voltages. In all cases, measured accuracy is within ±1%.

Equation 12. ADS131E04 ADS131E06 ADS131E08 eq_MAccuracy_sbas705.gif
ADS131E04 ADS131E06 ADS131E08 D018_sbas705.gif
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2, VREF = 2.4 V, measurement accuracy is absolute value
Figure 61. Input Voltage vs ADC Measurement Error:
2.4-V Reference
ADS131E04 ADS131E06 ADS131E08 D020_sbas705.gif
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2, VREF = 2.4 V
Figure 63. Input Current vs ADC Measurement Error:
2.4-V Reference
ADS131E04 ADS131E06 ADS131E08 D019_sbas705.gif
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2, VREF = 4 V, measurement accuracy is absolute value
Figure 62. Input Voltage vs ADC Measurement Error:
4-V Reference
ADS131E04 ADS131E06 ADS131E08 D021_sbas705.gif
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2, VREF = 4 V
Figure 64. Input Current vs ADC measurement Error:
4-V Reference
ADS131E04 ADS131E06 ADS131E08 apps_tipd_logo_bas557.gif For a step-by-step design procedure, circuit schematics, bill of materials, PCB files, simulation results, and test results, see High Resolution, Fast Startup Analog Front End for Air Circuit Breaker Design Guide (TIDUB80).