SLLS848C April   2008  – April 2024 AM26LV31E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Complementary Out-Enable Inputs
      2. 7.3.2 High Output Impedance for Specific Driver Enable Inputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (September 2016) to Revision C (April 2024)

  • Changed the Device Information table to the Package Information tableGo
  • Changed the Thermal Information tableGo
  • Changed the note in Figure 6-3 Go

Changes from Revision A (May 2008) to Revision B (September 2016)

  • Added Applications section, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted Ordering Information table, see Mechanical, Packaging, and Orderable Information at the end of the datasheetGo
  • Changed ESD PROTECTION to ESD Ratings tableGo
  • Changed RθJA for PW package from 108°C/W: to 99.5°C/WGo
  • Changed RθJA for NS package from 64°C/W: to 74.5°C/WGo
  • Changed RθJA for RGY package from 39°C/W: to 39.3°C/WGo