SLLS202H may   1995  – august 2023 AM26LV32

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Conditions
      2. 8.4.2 Fail-Safe Precautions
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (October 2017) to Revision H (August 2023)

  • Changed the Device Information table to the Package Information tableGo
  • Changed the AM26LV32I temperature from: −45°C to 85°C to: −40°C to 85°C in the Description Go
  • Changed the Thermal Information tableGo
  • Changed the Typical Characteristics Go

Changes from Revision F (November 2016) to Revision G (October 2017)

  • Changed the MAX value of tsk(p) From: 6 ns To: 14 ns in the Switching Characteristics tableGo
  • Changed the MAX value of tsk(o) From: 6 ns To: 14 ns in the Switching Characteristics tableGo

Changes from Revision E (June 2005) to Revision F (November 2016)

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted MB570 from Features listGo
  • Deleted Ordering Information table; see Mechanical, Packaging, and Orderable Information at the end of the data sheetGo
  • Deleted Lead temperature (260°C maximum) from Absolute Maximum Ratings tableGo
  • Changed Package thermal impedance, RθJA, values in Thermal Information table From: 73°C To: 72.9°C (D) and From: 64°C To: 74°C (NS)Go