SBASAW1A September   2023  – December 2023 AMC21C12

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Package Characteristics
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics 
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Reference Input
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Open-Drain Digital Output
        1. 6.3.4.1 Transparent Output Mode
        2. 6.3.4.2 Latch Output Mode
      5. 6.3.5 Power-Up and Power-Down Behavior
      6. 6.3.6 VDD1 Brownout and Power-Loss Behavior
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Overcurrent Detection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Overvoltage Detection
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Best Design Practices

Keep the connection between the low-side of the sense resistor and the GND1 pin of the AMC21C12 short and low impedance. Any voltage drop in the ground line adds error to the voltage sensed at the input of the comparator and leads to inaccuracies in the trip thresholds.

For best common-mode transient immunity, place the filter capacitor C5 as closely to the REF pin as possible as illustrated in Figure 7-7. Use a low value pullup resistor (<10 kΩ) on the open-drain output, as explained in the Open-Drain Digital Output Open-Drain Digital Output Transparent Output ModeLatch Output ModePower-Up and Power-Down BehaviorVDD1 Brownout and Power-Loss Behavior Open-Drain Digital Output section, to minimize the effect of capacitive coupling on the open-drain signal line during a common-mode transient event.

Do not exceed the 300-mV VREF limit specified in the Recommended Operating ConditionsRecommended Operating Conditions table for bidirectional current-sensing applications. Do not operate the device with the REF pin biased close to the VMSEL threshold (450-mV to 600-mV range) to avoid dynamic switching of the Cmp0 hysteresis as explained in the Reference InputAnalog InputReference InputReference InputReference Input section.

The AMC21C12 provides a limited 200-μs blanking time (tHS,BLK) to allow the reference voltage (VREF) to settle during start up. For many applications, the reference voltage takes longer to settle than the 200-μs blanking time and the output of the comparator can possibly glitch during system start up as described in Figure 6-2. Consider the reference voltage settling time in the overall system start-up design.