SLPS411G April   2013  – January 2022 CSD17381F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Support Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision F (October 2021) to Revision G (January 2022)

  • Changed height dimension from "0.35 mm" to "0.36 mm" Features Go
  • Changed height dimension from "0.35 mm" to "0.36 mm" in Typical Dimensions Go
  • Changed height dimension from "0.35 mm" to "0.36 mm" in Mechanical Dimensions Go

Changes from Revision E (December 2017) to Revision F (October 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed footnote to refer to correct support documentGo

Changes from Revision D (August 2014) to Revision E (December 2017)

  • Changed Pulsed Drain Current value From: 10 A To: 12 A in the Absolute Maximum Ratings table. Go
  • Change Note 2 From: Pulse duration ≤300 μs, duty cycle ≤2% To: Pulse duration ≤ 100 μs, duty cycle ≤ 1%Go
  • Updated Figure 5-1. Go
  • Updated Figure 5-10 with newly measured data. Go
  • Updated all mechanical drawings, increased the size of the pads in Section 7.3 Go