SLASEF4B February   2017  â€“ July 2017 DAC38RF86 , DAC38RF87 , DAC38RF96 , DAC38RF97

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - DC Specifications
    6. 7.6  Electrical Characteristics - Digital Specifications
    7. 7.7  Electrical Characteristics - AC Specifications
    8. 7.8  PLL/VCO Electrical Characteristics
    9. 7.9  Timing Requirements
    10. 7.10 Typical Characteristics, DAC38RF86 and DAC38RF96
      1. 7.10.1 Typical Characteristics, DAC38RF87 and DAC38RF97
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  SerDes Inputs
      2. 8.3.2  SerDes Rate
      3. 8.3.3  SerDes PLL
      4. 8.3.4  SerDes Equalizer
      5. 8.3.5  JESD204B Descrambler
      6. 8.3.6  JESD204B Frame Assembly
      7. 8.3.7  SYNC Interface
      8. 8.3.8  Single or Dual Link Configuration
      9. 8.3.9  Multi-Device Synchronization
      10. 8.3.10 SYSREF Capture Circuit
      11. 8.3.11 JESD204B Subclass 0 support
      12. 8.3.12 SerDes Test Modes through Serial Programming
      13. 8.3.13 SerDes Test Modes through IEEE 1500 Programming
      14. 8.3.14 Error Counter
      15. 8.3.15 Eye Scan
      16. 8.3.16 JESD204B Pattern Test
      17. 8.3.17 Multiband DUC (multi-DUC)
        1. 8.3.17.1 Multi-DUC input
        2. 8.3.17.2 Interpolation Filters
        3. 8.3.17.3 JESD204B Modes, Interpolation and Clock phase Programming
        4. 8.3.17.4 Digital Quadrature Modulator
        5. 8.3.17.5 Low Power Coarse Resolution Mixing Modes
        6. 8.3.17.6 Inverse Sinc Filter
        7. 8.3.17.7 Summation Block for Dual DUC Modes
      18. 8.3.18 PA Protection Block
      19. 8.3.19 Gain Block
      20. 8.3.20 Output Summation
      21. 8.3.21 Output Delay
      22. 8.3.22 Polarity Inversion
      23. 8.3.23 Temperature Sensor
      24. 8.3.24 Alarm Monitoring
      25. 8.3.25 Differential Clock Inputs
      26. 8.3.26 CMOS Digital Inputs
      27. 8.3.27 DAC Fullscale Output Current
      28. 8.3.28 Current Steering DAC Architecture
      29. 8.3.29 DAC Transfer Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Clocking Modes
      2. 8.4.2 PLL Bypass Mode Programming
      3. 8.4.3 Internal PLL/VCO
      4. 8.4.4 CLKOUT
      5. 8.4.5 Serial Peripheral Interface (SPI)
        1. 8.4.5.1 NORMAL (RW)
        2. 8.4.5.2 WRITE_TO_CLEAR (W0C)
    5. 8.5 Register Maps
      1. 8.5.1  Chip Reset and Configuration Register (address = 0x00) [reset = 0x5803]
      2. 8.5.2  IO Configuration Register (address = 0x01) [reset = 0x1800]
      3. 8.5.3  Lane Single Detect Alarm Mask Register (address = 0x02) [reset = 0xFFFF]
      4. 8.5.4  Clock Alarms Mask Register (address = 0x03) [reset = 0xFFFF
      5. 8.5.5  SERDES Loss of Signal Detection Alarms Register (address = 0x04) [reset = 0x0000]
      6. 8.5.6  SYSREF Alignment Circuit Alarms Register (address = 0x05) [reset = 0x0000]
      7. 8.5.7  Temperature Sensor and PLL Loop Voltage Register (address = 0x06) [reset = variable]
      8. 8.5.8  Page Set Register (address = 0x09) [reset = 0x0000]
      9. 8.5.9  SYSREF Align to r1 and r3 Count Register (address = 0x78) [reset = 0x0000]
      10. 8.5.10 SYSREF Phase Count 1 and 2 Register (address = 0x79) [reset = 0x0000]
      11. 8.5.11 SYSREF Phase Count 3 and 4 Register (address = 0x7A) [reset = 0x0000]
      12. 8.5.12 Vendor ID and Chip Version Register (address = 0x7F) [reset = 0x0008]]
      13. 8.5.13 Multi-DUC Configuration (PAP, Interpolation) Register (address = 0x0A) [reset = 0x02B0]
      14. 8.5.14 Multi-DUC Configuration (Mixers) Register (address = 0x0C) [reset = 0x2402]
      15. 8.5.15 JESD FIFO Control Register (address = 0x0D) [reset = 0x1300]
      16. 8.5.16 Alarm Mask 1 Register (address = 0x0E) [reset = 0x00FF]
      17. 8.5.17 Alarm Mask 2 Register (address = 0x0F) [reset = 0xFFFF]
      18. 8.5.18 Alarm Mask 3 Register (address = 0x10) [reset = 0xFFFF]
      19. 8.5.19 Alarm Mask 4 Register (address = 0x11) [reset = 0xFFFF]
      20. 8.5.20 JESD Lane Skew Register (address = 0x12) [reset = 0x0000]
      21. 8.5.21 CMIX Configuration Register (address = 0x17) [reset = 0x0000]
      22. 8.5.22 Output Summation and Delay Register (address = 0x19) [reset = 0x0000]
      23. 8.5.23 NCO Phase Path AB Register (address = 0x1C) [reset = 0x0000]
      24. 8.5.24 NCO Phase Path CD Register (address = 0x1D) [reset = 0x0000]
      25. 8.5.25 NCO Frequency Path AB Register (address = 0x1E-0x20) [reset = 0x0000 0000 0000]
      26. 8.5.26 NCO Frequency Path CD Register (address = 0x21-0x23) [reset = 0x0000 0000 0000]
      27. 8.5.27 SYSREF Use for Clock Divider Register (address = 0x24) [reset = 0x0010]
      28. 8.5.28 Serdes Clock Control Register (address = 0x25) [reset = 0x7700]
      29. 8.5.29 Sync Source Control 1 Register (address = 0x27) [reset = 0x1144]
      30. 8.5.30 Sync Source Control 2 Register (address = 0x28) [reset = 0x0000]
      31. 8.5.31 PAP path AB Gain Attenuation Step Register (address = 0x29) [reset = 0x0000]
      32. 8.5.32 PAP path AB Wait Time Register (address = 0x2A) [reset = 0x0000]
      33. 8.5.33 PAP path CD Gain Attenuation Step Register (address = 0x2B) [reset = 0x0000]
      34. 8.5.34 PAP Path CD Wait Time Register (address = 0x2C) [reset = 0x0000]
      35. 8.5.35 PAP path AB Configuration Register (address = 0x2D) [reset = 0x0FFF]
      36. 8.5.36 PAP path CD Configuration Register (address = 0x2E) [reset = 0x0FFF]
      37. 8.5.37 DAC SPI Configuration Register (address = 0x2F) [reset = 0x0000]
      38. 8.5.38 DAC SPI Constant Register (address = 0x30) [reset = 0x0000]
      39. 8.5.39 Gain for path AB Register (address = 0x32) [reset = 0x0000]
      40. 8.5.40 Gain for path CD Register (address = 0x33) [reset = 0x0000]
      41. 8.5.41 JESD Error Counter Register (address = 0x41) [reset = 0x0000]
      42. 8.5.42 JESD ID 1 Register (address = 0x46) [reset = 0x0044]
      43. 8.5.43 JESD ID 2 Register (address = 0x47) [reset = 0x190A]
      44. 8.5.44 JESD ID 3 and Subclass Register (address = 0x48) [reset = 0x31C3]
      45. 8.5.45 JESD Lane Enable Register (address = 0x4A) [reset = 0x0003]
      46. 8.5.46 JESD RBD Buffer and Frame Octets Register (address = 0x4B) [reset = 0x1300]
      47. 8.5.47 JESD K and L Parameters Register (address = 0x4C) [reset = 0x1303]
      48. 8.5.48 JESD M and S Parameters Register (address = 0x4D) [reset = 0x0100]
      49. 8.5.49 JESD N, HD and SCR Parameters Register (address = 0x4E) [reset = 0x0F4F]
      50. 8.5.50 JESD Character Match and Other Register (address = 0x4F) [reset = 0x1CC1]
      51. 8.5.51 JESD Link Configuration Data Register (address = 0x50) [reset = 0x0000]
      52. 8.5.52 JESD Sync Request Register (address = 0x51) [reset = 0x00FF]
      53. 8.5.53 JESD Error Output Register (address = 0x52) [reset = 0x00FF]
      54. 8.5.54 JESD ILA Check 1 Register (address = 0x53) [reset = 0x0100]
      55. 8.5.55 JESD ILA Check 2 Register (address = 0x54) [reset = 0x8E60]
      56. 8.5.56 JESD SYSREF Mode Register (address = 0x5C) [reset = 0x0001]
      57. 8.5.57 JESD Crossbar Configuration 1 Register (address = 0x5F) [reset = 0x0123]
      58. 8.5.58 JESD Crossbar Configuration 2 Register (address = 0x60) [reset = 0x4567]
      59. 8.5.59 JESD Alarms for Lane 0 Register (address = 0x64) [reset = 0x0000]
      60. 8.5.60 JESD Alarms for Lane 1 Register (address = 0x65 01100101) [reset = 0x0000]
      61. 8.5.61 JESD Alarms for Lane 2 Register (address = 0x66) [reset = 0x0000]
      62. 8.5.62 JESD Alarms for Lane 3 Register (address = 0x67) [reset = 0x0000]
      63. 8.5.63 JESD Alarms for Lane 4 Register (address = 0x68) [reset = 0x0000]
      64. 8.5.64 JESD Alarms for Lane 5 Register (address = 0x69) [reset = 0x0000]
      65. 8.5.65 JESD Alarms for Lane 6 Register (address = 0x6A [reset = 0x0000]
      66. 8.5.66 JESD Alarms for Lane 7 Register (address = 0x6B) [reset = 0x0000]
      67. 8.5.67 SYSREF and PAP Alarms Register (address = 0x6C) [reset = 0x0000]
      68. 8.5.68 Clock Divider Alarms 1 Register (address = 0x6D) [reset = 0x0000]
      69. 8.5.69 Clock Configuration Register (address = 0x0A) [reset = 0xF000]
      70. 8.5.70 Sleep Configuration Register (address = 0x0B) [reset = 0x0022]
      71. 8.5.71 Divided Output Clock Configuration Register (address = 0x0C) [reset = 0x8000]
      72. 8.5.72 DAC Fullscale Current Register (address = 0x0D) [reset = 0xF000]
      73. 8.5.73 Internal SYSREF Generator Register (address = 0x10) [reset = 0x0000]
      74. 8.5.74 Counter for Internal SYSREF Generator Register (address = 0x11) [reset = 0x0000]
      75. 8.5.75 SPI SYSREF for Internal SYSREF Generator Register (address = 0x12) [reset = 0x0000]
      76. 8.5.76 Digital Test Signals Register (address = 0x1B) [reset = 0x0000]
      77. 8.5.77 Sleep Pin Control Register (address = 0x23) [reset = 0xFFFF]
      78. 8.5.78 SYSREF Capture Circuit Control Register (address = 0x24) [reset = 0x1000]
      79. 8.5.79 Clock Input and PLL Configuration Register (address = 0x31) [reset = 0x0200]
      80. 8.5.80 PLL Configuration 1 Register (address = 0x32) [reset = 0x0308]
      81. 8.5.81 PLL Configuration 2 Register (address = 0x33) [reset = 0x4018]
      82. 8.5.82 LVDS Output Configuration Register (address = 0x34) [reset = 0x0000]
      83. 8.5.83 Fuse Farm clock divider Register (address = 0x35) [reset = 0x0018]
      84. 8.5.84 Serdes Clock Configuration Register (address = 0x3B) [reset = 0x0002]
      85. 8.5.85 Serdes PLL Configuration Register (address = 0x3C) [reset = 0x8228]
      86. 8.5.86 Serdes Configuration 1 Register (address = 0x3D) [reset = 0x0x0088]
      87. 8.5.87 Serdes Configuration 2 Register (address = 0x3E) [reset = 0x0x0909]
      88. 8.5.88 Serdes Polarity Control Register (address = 0x3F) [reset = 0x0000]
      89. 8.5.89 JESD204B SYNCB OUTPUT Register (address = 0x76) [reset = 0x0000]
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Start-up Sequence
    2. 9.2 Typical Application: Multi-band Radio Frequency Transmitter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Calculating the JESD204B SerDes Rate
        2. 9.2.2.2 Calculating valid JESD204B SYSREF Frequency
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services.

Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agrees that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their systems and products, and have full and exclusive responsibility to assure the safety of their products and compliance of their products (and of all TI products used in or for such Designers’ products) with all applicable regulations, laws and other applicable requirements. Designers represent that, with respect to their applications, they have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designers agree that prior to using or distributing any systems that include TI products, they will thoroughly test such systems and the functionality of such TI products as used in such systems.

TI’s provision of reference designs and any other technical, applications or design advice, quality characterization, reliability data or other information or services does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such reference designs or other items.

Designers are authorized to use, copy and modify any individual TI reference design only in connection with the development of end products that include the TI product(s) identified in that reference design. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of the reference design or other items described above may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

TI REFERENCE DESIGNS AND OTHER ITEMS DESCRIBED ABOVE ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING THE REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNERS AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS AS DESCRIBED IN A TI REFERENCE DESIGN OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THE REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-compliance with the terms and provisions of this Notice.

IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated