SLAS971E May   2014  – December 2020 HD3SS215

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings (1) (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics, Device Parameters (1)
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Speed Switching
      2. 8.3.2 HPD, AUX, and DDC Switching
      3. 8.3.3 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
      1. 8.4.1 Switch Control Modes
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 DisplayPort and Dual Mode Adapter with Two Sources
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 HDMI Application with Two Sinks
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 35
      4. 9.2.4 HDMI 2:1 Sink Application Using the RTQ Package
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision D (September 2015) to Revision E (December 2020)

  • NOTE: The device in the MicroStar Jr. BGA packaging were redesigned using a laminate nFBGA package. This nFBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar Jr. BGA. The new package designator in place of the discontinued package designator will be updated throughout the datasheet.Go
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.Go
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed u*jr ZQE to nFBGA ZXHGo

Changes from Revision C (August 2015) to Revision D (September 2015)

  • Changed Section 3 text string from "....DisplayPort 1.2a..." to "...DisplayPort HBR2..." and from "..HDMI2.0.." to "...HDMI..." Go
  • Deleted RθJC(bot) spec from Thermal Information table as N/AGo
  • Deleted "Operating free air temperature" spec from Electrical Characteristics tableGo
  • Changed Figure 9-5 Go
  • Changed Section 10 text string from "Decoupling capacitors may be used to reduce noise and improve power supply integrity" to "Decoupling capacitors must be used to reduce power supply noise"Go

Changes from Revision B (July 2015) to Revision C (July 2015)

  • Added ton(OE_L-H), toff(OE_H-L), and tSWITCH_OVER to the Section 7.7 Go

Changes from Revision A (May 2014) to Revision B (July 2015)

  • Changed the title From: "2.0/DisplayPort 1.2A" To: "DisplayPort"Go
  • Changed Section 1 list item From: Compatible With DisplayPort 1.2a Electrical Standard To: Compatible With DisplayPort Electrical StandardGo
  • Changed Section 1 list item From: Compatible With HDMI 1.4b and HDMI 2.0 Electrical Standards To: Compatible With HDMI Electrical StandardsGo
  • Added Section 1 item: Commercial Temperature Range: –40°C to 70°C (HD3SS215)Go
  • Added Section 1 item: Inductrial Temperature Range: –40°C to 85°C (HD3SS215I)Go
  • Added Section 1 , Package Options: 8 mm × 8 mm, 56-Pin RTQGo
  • Changed the Section 2 list item From: TV and Monitors To: UHDTV, HDTV and MonitorsGo
  • Added Section 5 paragraph. Go
  • Added the 56-Pin QFN imageGo
  • Added RTQ column to the Pin Functions table Go
  • Added RTQ column to the Pin Functions table Go
  • Moved Tstg From: Section 7.2 To: Section 7.1 Go
  • Changed the Handling Ratings table to Section 7.2 table Go
  • Added HD3SS2151I, Operating free-air temperature Section 7.3 Go
  • Added RTQ 56 PIN values to the Section 7.4 Go
  • Added table Note " This pin can be driven.." to the Section 7.5 tableGo
  • Changed the Section 7.6 table to include ZQE and RTQ package valuesGo
  • Added the Section 7.7 table Go
  • Added section: Section 9.2.4 Go
  • Added Figure 10-3 Go

Changes from Revision * (May 2014) to Revision A (May 2014)