SLAS971E May   2014  – December 2020 HD3SS215

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings (1) (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Electrical Characteristics, Device Parameters (1)
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Speed Switching
      2. 8.3.2 HPD, AUX, and DDC Switching
      3. 8.3.3 Output Enable and Power Savings
    4. 8.4 Device Functional Modes
      1. 8.4.1 Switch Control Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 DisplayPort and Dual Mode Adapter with Two Sources
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 HDMI Application with Two Sinks
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 35
      4. 9.2.4 HDMI 2:1 Sink Application Using the RTQ Package
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Electrical Characteristics, Device Parameters(1)

Under recommended operating conditions; RLOAD, RSC = 50 Ω (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
RLDx Differential return lossZXH package1.35 GHz–15dB
3 GHz–12
RTQ package1.35 GHz–17
3 GHz–13
XTALKDx Differential crosstalkZXH package2.7 GHz–35dB
RTQ package–35
OIRRDx Differential off-isolationZXH package3 GHz–21dB
RTQ package–16
ILDx Differential insertion lossZXH packagef = 1.35 GHz–1.2dB
f = 3 GHz–1.6
RTQ packagef = 1.35 GHz–2dB
f = 3 GHz–2.4
BWDxDx Differential -3-dB bandwidthZXH package7GHz
RTQ package5
BWAUXAUX –3-dB bandwidth720MHz
(1) For Return Loss, Crosstalk, Off-Isolation, and Insertion Loss values the data was collected on a Rogers material board with minimum length traces on the input and output of the device under test.