SNAS778D June 2021 – July 2024 HDC3020 , HDC3021 , HDC3022
PRODUCTION DATA
THERMAL METRIC(1) | HDC3x | UNIT | |
---|---|---|---|
DEF, DEH, and DEJ (WSON) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 84.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance(2) | N/A | °C/W |
RθJB | Junction-to-board thermal resistance | 52.0 | °C/W |
ΨJT | Junction-to-top characterization parameter(2) | N/A | °C/W |
ΨJB | Junction-to-board characterization parameter | 51.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 30.4 | °C/W |