SNAS778D June 2021 – July 2024 HDC3020 , HDC3021 , HDC3022
PRODUCTION DATA
PIN | TYPE(1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
ADDR | 2 | I | I2C Device Address
Pin. For device addresses 0x44 and 0x45, ADDR1 voltage must be GND. 0x44 requires ADDR voltage to be GND. 0x45 requires ADDR voltage to be VDD. Can not be left floating. |
ADDR1 | 7 | I | I2C Device Address
Pin. For device addresses 0x46 and 0x47, ADDR1 voltage must be VDD. 0x46 requires ADDR voltage to be GND. 0x47 requires ADDR voltage to be VDD. Can not be left floating. |
ALERT | 3 | O | Interrupt Pin. Push-Pull Output. If not used, must be left floating. |
GND | 8 | G | Ground |
RESET | 6 | I | Reset Pin. Active Low, internal pull-up resistor to VDD. If not used, tie to VDD. |
SCL | 4 | I | Serial clock line for I2C. |
SDA | 1 | I/O | Serial data line for I2C, open-drain; requires a pullup resistor. |
VDD | 5 | P | Supply voltage from 1.62 V to 5.50 V. |
Thermal Pad | 9 | G | The thermal pad can be soldered, or left unsoldered. If choosing to solder the thermal pad, attach to a pad that is connected to GND, or preferably a floating pad. To minimize thermal mass for maximum heater efficiency or to measure ambient temperature, however, the thermal pad can be left unconnected to the PCB. |