SLLSEM2F November   2014  – March 2016 ISO7821

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Dissipation Characteristics
    6. 6.6  Electrical Characteristics, 5 V
    7. 6.7  Electrical Characteristics, 3.3 V
    8. 6.8  Electrical Characteristics, 2.5 V
    9. 6.9  Switching Characteristics, 5 V
    10. 6.10 Switching Characteristics, 3.3 V
    11. 6.11 Switching Characteristics, 2.5 V
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 High Voltage Feature Description
        1. 8.3.1.1 Regulatory Information
        2. 8.3.1.2 Safety Limiting Values
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 9.2.3 Application Performance Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 PCB Material
    2. 11.2 Layout Guidelines
    3. 11.3 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Description

Overview

ISO7821 employs an ON-OFF Keying (OOK) modulation scheme to transmit the digital data across a silicon dioxide based isolation barrier. The transmitter sends a high frequency carrier across the barrier to represent one digital state and sends no signal to represent the other digital state. The receiver demodulates the signal after advanced signal conditioning and produces the output through a buffer stage. These devices also incorporates advanced circuit techniques to maximize the CMTI performance and minimize the radiated emissions due the high frequency carrier and IO buffer switching. The conceptual block diagram of a digital capacitive isolator, Figure 11, shows a functional block diagram of a typical channel.

Functional Block Diagram

ISO7821 ISO7821F fbd_sllsej0.gif Figure 11. Conceptual Block Diagram of a Digital Capacitive Isolator

Also a conceptual detail of how the ON/OFF Keying scheme works is shown in Figure 12.

ISO7821 ISO7821F on_off_keying_sllsem2.gif Figure 12. On-Off Keying (OOK) Based Modulation Scheme

Feature Description

ISO7821 is available in two channel configurations and default output state options to enable a variety of application uses.

PRODUCT CHANNEL DIRECTION RATED ISOLATION MAX DATA RATE DEFAULT OUTPUT
ISO7821 1 Forward, 1 Reverse
5700 VRMS / 8000 VPK (1) 100 Mbps High
ISO7821F 1 Forward, 1 Reverse
5700 VRMS / 8000 VPK (1) 100 Mbps Low
See the Regulatory Information section for detailed isolation ratings.

High Voltage Feature Description

NOTE

This coupler is suitable for 'safe electrical insulation' only within the safety ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.

Table 1. Package Insulation and Safety-Related Specifications
(over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CLR External clearance Shortest terminal-to-terminal distance through air DW-16 8 mm
DWW-16 14.5
CPG External creepage Shortest terminal-to-terminal distance across the package surface DW-16 8 mm
DWW-16 14.5
CTI Comparative tracking index DIN EN 60112 (VDE 0303-11); IEC 60112; UL 746A 600 V
RIO Isolation resistance, input to output(1) VIO = 500 V, TA = 25°C 1012 Ω
VIO = 500 V, 100°C ≤ TA ≤ max 1011 Ω
CIO Barrier capacitance, input to output(1) VIO = 0.4 x sin (2πft), f = 1 MHz 1 pF
CI Input capacitance(2) VI = VCC/2 + 0.4 x sin (2πft), f = 1 MHz, VCC = 5 V 2 pF
All pins on each side of the barrier tied together creating a two-terminal device.
Measured from input pin to ground.

NOTE

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.

Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.

Table 2. Insulation Characteristics

PARAMETER TEST CONDITIONS SPECIFICATION UNIT
DW DWW
DTI Distance through the insulation Minimum internal gap (internal clearance) 21 21 μm
VIOWM Maximum working isolation voltage Time dependent dielectric breakdown (TDDB) test 1500 2000 VRMS
2121 2828 VDC
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
VIOTM Maximum transient isolation voltage VTEST = VIOTM
t = 60 sec (qualification)
t= 1 sec (100% production)
8000 8000 VPK
VIOSM Maximum surge isolation voltage Test method per IEC 60065, 1.2/50 µs waveform,
VTEST = 1.6 x VIOSM = 12800 VPK(1) (qualification)
8000 8000 VPK
VIORM Maximum repetitive peak isolation voltage 2121 2828 VPK
VPR Input-to-output test voltage Method a, After Input/Output safety test subgroup 2/3,
VPR = VIORM x 1.2, t = 10 s,
Partial discharge < 5 pC
2545 3394 VPK
Method a, After environmental tests subgroup 1,
VPR = VIORM x 1.6, t = 10 s,
Partial Discharge < 5 pC
3394 4525
Method b1,After environmental tests subgroup 1,
VPR = VIORM x 1.875, t = 1 s (100% Production test)
Partial discharge < 5 pC
3977 5303
RS Isolation resistance VIO = 500 V at TS >109 >109 Ω
Pollution degree 2 2
Climatic category 55/125/21 55/125/21
UL 1577
VISO Withstanding isolation voltage VTEST = VISO = 5700 VRMS, t = 60 sec (qualification);
VTEST = 1.2 x VISO = 6840 VRMS , t = 1 sec (100% production)
5700 5700 VRMS
Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.

Table 3. IEC 60664-1 Ratings Table

PARAMETER TEST CONDITIONS SPECIFICATION
Material group I
Overvoltage category / Installation classification DW package Rated mains voltage ≤ 600 VRMS I–IV
Rated mains voltage ≤ 1000 VRMS I–III
DWW package Rated mains voltage ≤ 1000 VRMS I–IV

Regulatory Information

DW package certifications are complete; DWW package certifications completed for UL and TUV and planned for VDE, CSA, and CQC.

Table 4. Regulatory Information

VDE CSA UL CQC TUV
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 60950-1 (VDE 0805 Teil 1):2011-01 Approved under CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 Recognized under UL 1577 Component Recognition Program Certified according to GB 4943.1-2011 Certified according to
EN 61010-1:2010 (3rd Ed) and
EN 60950-1:2006/A11:2009/
A1:2010/A12:2011/A2:2013
Reinforced insulation
Maximum transient isolation voltage, 8000 VPK;
Maximum repetitive peak isolation voltage, 2121 VPK (DW), 2828 VPK (DWW);
Maximum surge isolation voltage, 8000 VPK
Reinforced insulation per CSA 60950-1-07+A1+A2 and IEC 60950-1 2nd Ed.,
800 VRMS (DW package) and 1450 VRMS (DWW package) max working voltage (pollution degree 2, material group I);
Single protection, 5700 VRMS Reinforced Insulation, Altitude ≤ 5000 m, Tropical Climate, 250 VRMS maximum working voltage 5700 VRMS Reinforced insulation per EN 61010-1:2010 (3rd Ed) up to working voltage of 600 VRMS (DW package) and 1000 VRMS (DWW package)
2 MOPP (Means of Patient Protection) per CSA 60601-1:14 and IEC 60601-1 Ed. 3.1,
250 VRMS (354 VPK) max working voltage (DW package)
5700 VRMS Reinforced insulation per EN 60950-1:2006/A11:2009/
A1:2010/A12:2011/A2:2013 up to working voltage of 800 VRMS (DW package) and 1450 VRMS (DWW package)
Certificate number: 40040142 Master contract number: 220991 File number: E181974 Certificate number: CQC15001121716 Client ID number: 77311

Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

Table 5. Safety Limiting

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current for DW-16 package and DWW-16 Packages RθJA = 84.7°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C 268 mA
RθJA = 84.7°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C 410
RθJA = 84.7°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C 537
PS Safety input, output, or total power RθJA = 84.7°C/W, TJ = 150°C, TA = 25°C 1476 mW
TS Maximum safety temperature 150 °C

The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information is that of a device installed on a High-K test board for Leaded Surface Mount Packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.

ISO7821 ISO7821F D014_SLLSEM2.gif Figure 13. Thermal Derating Curve for Safety Limiting Current per VDE
ISO7821 ISO7821F D015_SLLSEM2.gif Figure 14. Thermal Derating Curve for Safety Limiting Power per VDE

Device Functional Modes

ISO7821 functional modes are shown in Table 6.

Table 6. ISO7821 Function Table(1)

VCCI VCCO INPUT
(INx)(3)
OUTPUT ENABLE
(ENx)
(DWW Package Only)
OUTPUT
(OUTx)
COMMENTS
PU PU H H or open H Normal Operation:
A channel output assumes the logic state of its input.
L H or open L
Open H or open Default Default mode: When INx is open, the corresponding channel output goes to its default high logic state. Default= High for ISO7821 and Low for ISO7821F.
X PU X L Z A low value of Output Enable causes the outputs to be high- impedance.
PD PU X H or open Default Default mode: When VCCI is unpowered, a channel output assumes the logic state based on the selected default option.Default= High for ISO7821 and Low for ISO7821F.
When VCCI transitions from unpowered to powered-up, a channel output assumes the logic state of its input.
When VCCI transitions from powered-up to unpowered, channel output assumes the selected default state.
X PD X X Undetermined When VCCO is unpowered, a channel output is undetermined (2).
When VCCO transitions from unpowered to powered-up, a channel output assumes the logic state of its input
VCCI = Input-side VCC; VCCO = Output-side VCC; PU = Powered up (VCC ≥ 2.25 V); PD = Powered down (VCC ≤ 1.7 V); X = Irrelevant; H = High level; L = Low level; Z = High impedance
The outputs are in undetermined state when 1.7 V < VCCI, VCCO < 2.25 V.
A strongly driven input signal can weakly power the floating VCC via an internal protection diode and cause undetermined output.

Device I/O Schematics

ISO7821 ISO7821F device_IO_sllen2.gif Figure 15. Device I/O Schematics