SLCS006X October   1979  – October 2023 LM139 , LM139A , LM239 , LM239A , LM2901 , LM2901AV , LM2901B , LM2901V , LM339 , LM339A , LM339B

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Other Versions
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings for  LM339B and LM2901B
    2. 7.2  Absolute Maximum Ratings for Non-B Versions
    3. 7.3  ESD Ratings for LM339B and LM2901B
    4. 7.4  ESD Ratings, Non-B Versions
    5. 7.5  Recommended Operating Conditions for LM339B and LM2901B
    6. 7.6  Recommended Operating Conditions, Non-B Versions
    7. 7.7  Thermal Information for LM339B and LM2901B
    8. 7.8  Thermal Information for Non-B Versions
    9. 7.9  Electrical Characteristics for LM339B
    10. 7.10 Electrical Characteristics for LM2901B
    11. 7.11 Electrical Characteristics for LM139 and LM139A
    12. 7.12 Electrical Characteristics for LMx39 and LMx39A
    13. 7.13 Electrical Characteristics for LM2901, LM2901V and LM2901AV
    14. 7.14 Switching Characteristics for LM139 and LM139A
    15. 7.15 Switching Characteristics for LM339B and LM2901B
    16. 7.16 Switching Characteristics for LMx39 and LMx39A
    17. 7.17 Switching Characteristics for LM2901
    18. 7.18 Typical Characteristics for LM339B and LM2901B Only
    19. 7.19 Typical Characteristics, Non-B Versions
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Voltage Comparison
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Voltage Range
        2. 9.2.2.2 Minimum Overdrive Voltage
        3. 9.2.2.3 Output and Drive Current
        4. 9.2.2.4 Response Time
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Links
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 Thermal Information for Non-B Versions

THERMAL METRIC(1)LMx39, LM2901xUNIT
D (SOIC)DB (SSOP)N (PDIP)NS (SO)PW (TSSOP)J (CDIP)W (CFP)
RθJAJunction-to-ambient thermal resistance98.8111.87996.212089.5156.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance64.363.673.456.15946.186.7°C/W
RθJBJunction-to-board thermal resistance59.760.558.756.968.878.7154.6°C/W
ψJTJunction-to-top characterization parameter25.726.248.324.89.9356.5°C/W
ψJBJunction-to-board characterization parameter59.359.858.556.468.271.8133.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—————24.214.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.