SNAS691E December   2016  – December 2023 LMK62A2-100M , LMK62A2-150M , LMK62A2-156M , LMK62A2-200M , LMK62A2-266M , LMK62E0-156M , LMK62E2-100M , LMK62E2-156M , LMK62I0-100M , LMK62I0-156M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - Power Supply
    6. 5.6  LVPECL Output Characteristics
    7. 5.7  LVDS Output Characteristics
    8. 5.8  HCSL Output Characteristics
    9. 5.9  OE Input Characteristics
    10. 5.10 Frequency Tolerance Characteristics
    11. 5.11 Power-On/Reset Characteristics (VDD)
    12. 5.12 PSRR Characteristics
    13. 5.13 PLL Clock Output Jitter Characteristics
    14. 5.14 Additional Reliability and Qualification
  7. 6 Parameter Measurement Information
    1. 6.1 Device Output Configurations
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
        1. 7.2.1.1 Ensuring Thermal Reliability
        2. 7.2.1.2 Best Practices for Signal Integrity
        3. 7.2.1.3 Recommended Solder Reflow Profile
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIA|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics - Power Supply

VDD = 3.3 V ± 5%, TA = –40°C to 85°C(1)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
IDDDevice current consumptionLVPECL(2)95110mA
LVDS85100
HCSL(3)90105
IDD-PDDevice current consumption when output is disabledOE = GND70mA
(1) See Parameter Measurement Information for relevant test conditions.
(2) On-chip power dissipation should exclude 40 mW, dissipated in the 150-Ω termination resistors, from total power dissipation.
(3) Excludes load current.