SNOSB28G August   2010  – November 2014 LMP8640 , LMP8640-Q1 , LMP8640HV

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings - LMP8640, LMP8640HV
    3. 7.3 Handling Ratings - LMP8640-Q1
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics 2.7 V
    7. 7.7 Electrical Characteristics 5 V
    8. 7.8 Electrical Characteristics 12 V
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Selection of Sense Resistor
        1. 8.3.1.1 Resistor Power Rating and Thermal Issues
        2. 8.3.1.2 Using PCB Trace as a Sense Resistor
      2. 8.3.2 Sense Line Inputs
      3. 8.3.3 Effects of Series Resistance on Sense Lines
    4. 8.4 Device Functional Modes
      1. 8.4.1 Bias Current at Low Common Mode Voltage
      2. 8.4.2 Applying Input Voltage with No Supply Voltage
      3. 8.4.3 Driving an ADC
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Design Procedure
        1. 9.2.2.1 First Step - LMP8640 or LMP8640HV Selection
        2. 9.2.2.2 Second Step - Gain Option Selection
        3. 9.2.2.3 Third Step - Shunt Resistor Selection
      3. 9.2.3 Application Performance Plot
    3. 9.3 Do's and Don'ts Added Section
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

12.2 Documentation Support

12.2.1 Related Documentation

For related documantation, see the following:

  • AN-1975 LMP8640 / LMP8645 Evaluation Board User Guide, SNOA546
  • Absolute Maximum Ratings for Soldering, SNOA549

12.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 4. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LMP8640 Click here Click here Click here Click here Click here
LMP8640-Q1 Click here Click here Click here Click here Click here
LMP8640HV Click here Click here Click here Click here Click here

12.4 Trademarks

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.