SNOSB28G August   2010  – November 2014 LMP8640 , LMP8640-Q1 , LMP8640HV

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings - LMP8640, LMP8640HV
    3. 7.3 Handling Ratings - LMP8640-Q1
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics 2.7 V
    7. 7.7 Electrical Characteristics 5 V
    8. 7.8 Electrical Characteristics 12 V
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Selection of Sense Resistor
        1. 8.3.1.1 Resistor Power Rating and Thermal Issues
        2. 8.3.1.2 Using PCB Trace as a Sense Resistor
      2. 8.3.2 Sense Line Inputs
      3. 8.3.3 Effects of Series Resistance on Sense Lines
    4. 8.4 Device Functional Modes
      1. 8.4.1 Bias Current at Low Common Mode Voltage
      2. 8.4.2 Applying Input Voltage with No Supply Voltage
      3. 8.4.3 Driving an ADC
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Design Procedure
        1. 9.2.2.1 First Step - LMP8640 or LMP8640HV Selection
        2. 9.2.2.2 Second Step - Gain Option Selection
        3. 9.2.2.3 Third Step - Shunt Resistor Selection
      3. 9.2.3 Application Performance Plot
    3. 9.3 Do's and Don'ts Added Section
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (April 2013) to G Revision

  • New Q Device added to datasheet Go
  • Changed data sheet flow and layout to conform with new TI standards. Added the following sections: Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering Information Go