SLCS136U August 1999 – October 2020 LMV331 , LMV339 , LMV393
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | LMV339 | LMV393 | LMV331 | UNIT | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|
D | PW | RUC | D | DDU | DGK | PW | DBV | DCK | |||
14 PINS | 8 PINS | 5 PINS | |||||||||
RθJA | Junction-to-ambient thermal resistance | 86 | 113 | 216 | 97 | 210 | 172 | 149 | 206 | 252 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | — | — | 51.3 | — | — | — | — | — | — | |
RθJB | Junction-to-board thermal resistance | — | — | 59.0 | — | — | — | — | — | — | |
ψJT | Junction-to-top characterization parameter | — | — | 1.2 | — | — | — | — | — | — | |
ψJB | Junction-to-board characterization parameter | — | — | 59.0 | — | — | — | — | — | — |