SNAS824B October   2021  – June 2022 LMX2571-EP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Differences Between the LMX2571 and LMX2571-EP
      2. 7.3.2  Reference Oscillator Input
      3. 7.3.3  R-Dividers and Multiplier
      4. 7.3.4  PLL Phase Detector and Charge Pump
        1. 7.3.4.1 CPout Pin Charge Pump Current
        2. 7.3.4.2 Charge Pump Current When Using External VCO
      5. 7.3.5  PLL N-Divider and Fractional Circuitry
      6. 7.3.6  Partially Integrated Loop Filter
      7. 7.3.7  Low-Noise, Fully Integrated VCO
      8. 7.3.8  External VCO Support
      9. 7.3.9  Programmable RF Output Divider
      10. 7.3.10 Programmable RF Output Buffer
      11. 7.3.11 Integrated TX, RX Switch
      12. 7.3.12 Power Down
      13. 7.3.13 Lock Detect
      14. 7.3.14 FSK Modulation
      15. 7.3.15 FastLock
      16. 7.3.16 Register Readback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Mode
      2. 7.4.2 Duplex Mode
      3. 7.4.3 FSK Mode
    5. 7.5 Programming
      1. 7.5.1 Recommended Initial Power on Programming Sequence
      2. 7.5.2 Recommended Sequence for Changing Frequencies
    6. 7.6 Register Maps
      1. 7.6.1  R60 Register (offset = 3Ch) [reset = 4000h]
      2. 7.6.2  R58 Register (offset = 3Ah) [reset = C00h]
      3. 7.6.3  R53 Register (offset = 35h) [reset = 2802h]
      4. 7.6.4  R47 Register (offset = 2Fh) [reset = 0h]
      5. 7.6.5  R46 Register (offset = 2Eh) [reset = 1Ah]
      6. 7.6.6  R42 Register (offset = 2Ah) [reset = 210h]
      7. 7.6.7  R41 Register (offset = 29h) [reset = 810h]
      8. 7.6.8  R40 Register (offset = 28h) [reset = 101Ch]
      9. 7.6.9  R39 Register (offset = 27h) [reset = 11F0h]
      10. 7.6.10 R35 Register (offset = 23h) [reset = 647h]
      11. 7.6.11 R34 Register (offset = 22h) [reset = 1000h]
      12. 7.6.12 R33 Register (offset = 21h) [reset = 0h]
      13. 7.6.13 R25 to R32 Register (offset = 19h to 20h) [reset = 0h]
      14. 7.6.14 R24 Register (offset = 18h) [reset = 10h]
      15. 7.6.15 R23 Register (offset = 17h) [reset = 10A4h]
      16. 7.6.16 R22 Register (offset = 16h) [reset = 8584h]
      17. 7.6.17 R21 Register (offset = 15h) [reset = 101h]
      18. 7.6.18 R20 Register (offset = 14h) [reset = 28h]
      19. 7.6.19 R19 Register (offset = 13h) [reset = 0h]
      20. 7.6.20 R18 Register (offset = 12h) [reset = 0h]
      21. 7.6.21 R17 Register (offset = 11h) [reset = 0h]
      22. 7.6.22 R9 to R16 Register (offset = 9h to 10h) [reset = 0h]
      23. 7.6.23 R8 Register (offset = 8h) [reset = 10h]
      24. 7.6.24 R7 Register (offset = 7h) [reset = 10A4h]
      25. 7.6.25 R6 Register (offset = 6h) [reset = 8584h]
      26. 7.6.26 R5 Register (offset = 5h) [reset = 101h]
      27. 7.6.27 R4 Register (offset = 4h) [reset = 28h]
      28. 7.6.28 R3 Register (offset = 3h) [reset = 0h]
      29. 7.6.29 R2 Register (offset = 2h) [reset = 0h]
      30. 7.6.30 R1 Register (offset = 1h) [reset = 0h]
      31. 7.6.31 R0 Register (offset = 0h) [reset = 3h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Direct Digital FSK Modulation
      2. 8.1.2  Frequency and Output Port Switching
      3. 8.1.3  OSCin Configuration
      4. 8.1.4  Register R0 F1F2_INIT, F1F2_MODE Usage
      5. 8.1.5  FastLock With External VCO
      6. 8.1.6  OSCin Slew Rate
      7. 8.1.7  RF Output Buffer Power Control
      8. 8.1.8  RF Output Buffer Type
      9. 8.1.9  MULT Multiplier
      10. 8.1.10 Integrated VCO
    2. 8.2 Typical Applications
      1. 8.2.1 Synthesizer Duplex Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Synthesizer Duplex Mode Application Curves
      2. 8.2.2 PLL Duplex Mode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 PLL Duplex Mode Application Curves
      3. 8.2.3 Synthesizer/PLL Duplex Mode
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Synthesizer/PLL Duplex Mode Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.9 MULT Multiplier

The main purpose of the multiplier, MULT, in the R–divider is to push the in-band fractional spurs far away from the carrier such that the spurs could be filtered out by the loop filter. In a fractional engine, the fractional spurs appear at a multiple of fPD × Nfrac. In cases where both fPD and Nfrac are small, the fractional spurs will appear very close to the carrier. These kinds of spurs are called in-band spurs.

Table 8-6 MULT Application Example
USE CASE OSCin /MHz PRE-DIVIDER MULT POST-DIVIDER fPD /MHz VCO /MHz Ninteger Nfrac SPURS /MHz
I 19.2 1 1 1 19.2 460.8 24 0 0
II 19.2 1 1 1 19.2 461 24 0.0104167 0.2
III 19.2 1 5 4 24 461 19 0.2083333 5

In Case I, the VCO frequency is an integer multiple of the fPD, so Nfrac is zero and there are no spurs. However, in Case II, the spur appears at an offset of 200 kHz. If this spur cannot be reduced by other typical spur-reduction techniques such as dithering, user can enable the MULT to overcome this problem. If the MULT is enabled as depicted in Case III, the spurs can be pushed to an offset of 5 MHz. In this case, the MULT together with the Post-divider changes the phase detector to a little bit higher frequency. As a consequence, the spurs are pushed further away from the carrier and are reduced more by the loop filter.

Another use case of MULT is to make higher phase-detector frequency. For example, if OSCin is 20 MHz, user can set MULT to 5 to make fPD go to 100 MHz. As a result, the N-divider value will be reduced by 5 times; therefore, the PLL phase noise is reduced. A wide loop bandwidth can then be used to reduce the VCO noise. Consequently, the synthesizer close-in phase noise would be very good.

The MULT multiplier is an active device in nature, whenever it is enabled, it will add noise to the loop. For best phase noise performance, TI recommends setting the MULT not greater than 6.

To use the MULT, beware of the restriction as indicated in the Section 6.5 table and Table 7-21.