SLLS067I August   1990  – October 2022 SN55LBC176 , SN65LBC176 , SN75LBC176

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (Continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information: SN55LBC176
    4. 6.4 Thermal Information: SN65LBC176, SN75LBC176
    5. 6.5 Dissipation Ratings
    6. 6.6 Driver Electrical Characteristics
    7. 6.7 Driver Switching Characteristics
    8. 6.8 Receiver Electrical Characteristics
    9. 6.9 Receiver Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Thermal Characteristics of IC Packages
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information: SN55LBC176

THERMAL METRIC(1)FKJGUNIT
20 PINS8 PINS
RθJAJunction-to-ambient thermal resistance

61.6

99.5

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

36.8

51.5

RθJBJunction-to-board thermal resistance

36.1

86.5

ψJTJunction-to-top characterization parameter

31.0

23.7

ψJBJunction-to-board characterization parameter

36.0

80.2

RθJC(bot)Junction-to-case (bottom) thermal resistance

4.2

11.6

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.