SLLS067I August   1990  – October 2022 SN55LBC176 , SN65LBC176 , SN75LBC176

PRODUCTION DATA  

  1. Features
  2. Description
  3. Revision History
  4. Description (Continued)
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information: SN55LBC176
    4. 6.4 Thermal Information: SN65LBC176, SN75LBC176
    5. 6.5 Dissipation Ratings
    6. 6.6 Driver Electrical Characteristics
    7. 6.7 Driver Switching Characteristics
    8. 6.8 Receiver Electrical Characteristics
    9. 6.9 Receiver Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Thermal Characteristics of IC Packages
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT
Supply voltage, VCC(2)7V
Voltage range at any bus terminal–1015V
Input voltage, VI (D, DE, R, or RE)–0.3VCC + 0.5V
Receiver output current, IO–1010mA
Continuous total power dissipationSee Section 6.5
Storage temperature range, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.2 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltage, are with respect to network ground terminal.