SBOS833R October   2017  – November 2021 TLV9001 , TLV9002 , TLV9004

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TLV9001
    5. 7.5  Thermal Information: TLV9001S
    6. 7.6  Thermal Information: TLV9002
    7. 7.7  Thermal Information: TLV9002S
    8. 7.8  Thermal Information: TLV9004
    9. 7.9  Thermal Information: TLV9004S
    10. 7.10 Electrical Characteristics
    11. 7.11 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
    4. 8.4 Overload Recovery
    5. 8.5 Shutdown
    6. 8.6 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV900x Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply Photodiode Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C, V+ = 2.75 V, V– = –2.75 V, RL = 10 kΩ connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2 (unless otherwise noted)

TLV9001 TLV9002 TLV9004 Offset Voltage Distribution Histogram
VS = 5 V
Figure 7-1 Offset Voltage Distribution Histogram
TLV9001 TLV9002 TLV9004 Input Offset Voltage vs Temperature
Figure 7-3 Input Offset Voltage vs Temperature
TLV9001 TLV9002 TLV9004 Offset Voltage vs Supply Voltage
Figure 7-5 Offset Voltage vs Supply Voltage
TLV9001 TLV9002 TLV9004 IB and IOS vs Common-Mode Voltage
Figure 7-7 IB and IOS vs Common-Mode Voltage
TLV9001 TLV9002 TLV9004 Open-Loop Gain and Phase vs Frequency
CL = 10 pF
Figure 7-9 Open-Loop Gain and Phase vs Frequency
TLV9001 TLV9002 TLV9004 Closed-Loop Gain vs Frequency
CL = 10 pF
Figure 7-11 Closed-Loop Gain vs Frequency
TLV9001 TLV9002 TLV9004 PSRR vs Frequency
 
Figure 7-13 PSRR vs Frequency
TLV9001 TLV9002 TLV9004 CMRR vs Frequency
 
Figure 7-15 CMRR vs Frequency
TLV9001 TLV9002 TLV9004 0.1-Hz to 10-Hz Integrated Voltage Noise
Figure 7-17 0.1-Hz to 10-Hz Integrated Voltage Noise
TLV9001 TLV9002 TLV9004 THD + N vs Frequency
VS = 5.5 VVCM = 2.5 VG = 1
BW = 80 kHzVOUT = 0.5 VRMS
Figure 7-19 THD + N vs Frequency
TLV9001 TLV9002 TLV9004 Quiescent Current vs Supply Voltage
Figure 7-21 Quiescent Current vs Supply Voltage
TLV9001 TLV9002 TLV9004 Open-Loop Output Impedance vs Frequency
 
Figure 7-23 Open-Loop Output Impedance vs Frequency
TLV9001 TLV9002 TLV9004 Small
                        Signal Overshoot vs Capacitive Load
G = –1 VIN = 100 mVpp
Figure 7-25 Small Signal Overshoot vs Capacitive Load
TLV9001 TLV9002 TLV9004 No
                        Phase Reversal
G = 1 VIN = 6.5 VPP
Figure 7-27 No Phase Reversal
TLV9001 TLV9002 TLV9004 Small-Signal Step Response
G = 1VIN = 100 mVPPCL = 10 pF
Figure 7-29 Small-Signal Step Response
TLV9001 TLV9002 TLV9004 Large-Signal Settling Time (Negative)
G = 1CL = 100 pF2-V step
Figure 7-31 Large-Signal Settling Time (Negative)
TLV9001 TLV9002 TLV9004 Short-Circuit Current vs Temperature
Figure 7-33 Short-Circuit Current vs Temperature
TLV9001 TLV9002 TLV9004 Electromagnetic Interference Rejection Ratio Referred to Noninverting Input (EMIRR+) vs Frequency
Figure 7-35 Electromagnetic Interference Rejection Ratio Referred to Noninverting Input (EMIRR+) vs Frequency
TLV9001 TLV9002 TLV9004 Offset Voltage Drift Distribution Histogram
VS = 5 V, TA = –40°C to 125°C
Figure 7-2 Offset Voltage Drift Distribution Histogram
TLV9001 TLV9002 TLV9004 Offset Voltage vs Common-Mode
Figure 7-4 Offset Voltage vs Common-Mode
TLV9001 TLV9002 TLV9004 IB and IOS vs Temperature
Figure 7-6 IB and IOS vs Temperature
TLV9001 TLV9002 TLV9004 Open-Loop Gain vs Temperature
Figure 7-8 Open-Loop Gain vs Temperature
TLV9001 TLV9002 TLV9004 Open-Loop Gain vs Output Voltage
 
Figure 7-10 Open-Loop Gain vs Output Voltage
TLV9001 TLV9002 TLV9004 Output Voltage vs Output Current (Claw)
 
Figure 7-12 Output Voltage vs Output Current (Claw)
TLV9001 TLV9002 TLV9004 DC PSRR vs Temperature
VS = 1.8 V to 5.5 V
Figure 7-14 DC PSRR vs Temperature
TLV9001 TLV9002 TLV9004 DC CMRR vs Temperature
VCM = (V–) – 0.1 V to (V+) – 1.4 V
Figure 7-16 DC CMRR vs Temperature
TLV9001 TLV9002 TLV9004 Input Voltage Noise Spectral Density
Figure 7-18 Input Voltage Noise Spectral Density
TLV9001 TLV9002 TLV9004 THD + N vs Amplitude
VS = 5.5 VVCM = 2.5 Vƒ = 1 kHz
G = 1BW = 80 kHz
Figure 7-20 THD + N vs Amplitude
TLV9001 TLV9002 TLV9004 Quiescent Current vs Temperature
Figure 7-22 Quiescent Current vs Temperature
TLV9001 TLV9002 TLV9004 Small Signal Overshoot vs Capacitive Load
G = 1VIN = 100 mVpp
Figure 7-24 Small Signal Overshoot vs Capacitive Load
TLV9001 TLV9002 TLV9004 Phase
                        Margin vs Capacitive Load
 
Figure 7-26 Phase Margin vs Capacitive Load
TLV9001 TLV9002 TLV9004 Overload Recovery
G = –10 VIN = 600 mVPP
Figure 7-28 Overload Recovery
TLV9001 TLV9002 TLV9004 Large-Signal Step Response
G = 1VIN = 4 VPPCL = 10 pF
Figure 7-30 Large-Signal Step Response
TLV9001 TLV9002 TLV9004 Large-Signal Settling Time (Positive)
G = 1CL = 100 pF2-V step
Figure 7-32 Large-Signal Settling Time (Positive)
TLV9001 TLV9002 TLV9004 Maximum Output Voltage vs Frequency
Figure 7-34 Maximum Output Voltage vs Frequency
TLV9001 TLV9002 TLV9004 Channel Separation
Figure 7-36 Channel Separation