SBOS833R
October 2017 – November 2021
TLV9001
,
TLV9002
,
TLV9004
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information: TLV9001
7.5
Thermal Information: TLV9001S
7.6
Thermal Information: TLV9002
7.7
Thermal Information: TLV9002S
7.8
Thermal Information: TLV9004
7.9
Thermal Information: TLV9004S
7.10
Electrical Characteristics
7.11
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Operating Voltage
8.3.2
Rail-to-Rail Input
8.3.3
Rail-to-Rail Output
8.3.4
EMI Rejection
8.4
Overload Recovery
8.5
Shutdown
8.6
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
TLV900x Low-Side, Current Sensing Application
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
9.2.2
Single-Supply Photodiode Amplifier
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curves
10
Power Supply Recommendations
10.1
Input and ESD Protection
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DPW|5
MPSS088
DCK|5
MPDS025J
DCK|6
MPDS114E
DBV|5
MPDS018T
DBV|6
MPDS026Q
Thermal pad, mechanical data (Package|Pins)
DPW|5
QFND567C
Orderable Information
sbos833r_oa
sbos833r_pm
11.2
Layout Example
Figure 11-1
Schematic Representation
Figure 11-2
Layout Example