SBOS833R
October 2017 – November 2021
TLV9001
,
TLV9002
,
TLV9004
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information: TLV9001
7.5
Thermal Information: TLV9001S
7.6
Thermal Information: TLV9002
7.7
Thermal Information: TLV9002S
7.8
Thermal Information: TLV9004
7.9
Thermal Information: TLV9004S
7.10
Electrical Characteristics
7.11
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Operating Voltage
8.3.2
Rail-to-Rail Input
8.3.3
Rail-to-Rail Output
8.3.4
EMI Rejection
8.4
Overload Recovery
8.5
Shutdown
8.6
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
TLV900x Low-Side, Current Sensing Application
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
9.2.2
Single-Supply Photodiode Amplifier
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curves
10
Power Supply Recommendations
10.1
Input and ESD Protection
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
DSG|8
MPDS308C
DGS|10
MPDS035C
PW|8
MPDS568
RUG|10
MPQF216A
DGK|8
MPDS028E
YCK|9
MXBG450
DDF|8
MPDS569D
Thermal pad, mechanical data (Package|Pins)
DSG|8
QFND141I
RUG|10
QFND221
Orderable Information
sbos833r_oa
sbos833r_pm
12.1
Documentation Support