SBOS966H april 2019 – june 2023 TLV9061-Q1 , TLV9062-Q1 , TLV9064-Q1
PRODMIX
THERMAL METRIC(1) | TLV9064-Q1 | UNIT | ||
---|---|---|---|---|
PW (TSSOP) | D (SOIC) | |||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 133.8 | 111.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 62.1 | 67.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 76.9 | 67 | °C/W |
ψJT | Junction-to-top characterization parameter | 13.2 | 27.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 76.3 | 66.6 | °C/W |