SBOS966H april   2019  – june 2023 TLV9061-Q1 , TLV9062-Q1 , TLV9064-Q1

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Description (continued)
  7. Device Comparison Table
  8. Pin Configuration and Functions
  9. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information: TLV9061-Q1
    5. 8.5 Thermal Information: TLV9062-Q1
    6. 8.6 Thermal Information: TLV9064-Q1
    7. 8.7 Electrical Characteristics
    8. 8.8 Typical Characteristics
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Rail-to-Rail Input
      2. 9.3.2 Rail-to-Rail Output
      3. 9.3.3 Overload Recovery
      4. 9.3.4 Shutdown Function
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Low-Side Current Sense Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Typical Comparator Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Input and ESD Protection
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

The transfer function of the circuit in Figure 10-1 is given in Equation 1.

Equation 1. V O U T   =   I L O A D   × R S H U N T ×   G A I N

The load current (ILOAD) produces a voltage drop across the shunt resistor (RSHUNT). The load current is set from 0 A to 1 A. To keep the shunt voltage below 100 mV at maximum load current, the largest shunt resistor is defined using Equation 2.

Equation 2. R S H U N T   =   V S H U N T _ M A X I L O A D _ M A X   =   100   m V 1   A   =   100   m Ω

Using Equation 2, RSHUNT equals 100 mΩ. The voltage drop produced by ILOAD and RSHUNT is amplified by the TLV906x-Q1 to produce an output voltage of approximately 0 V to 4.95 V. Equation 3 calculates the gain required for the TLV906x-Q1 to produce the required output voltage.

Equation 3. G a i n   = V O U T _ M A X   -   V O U T _ M I N V I N _ M A X   -   V I N _ M I N

Using Equation 3, the required gain equals 49.5 V/V, which is set with the RF and RG resistors. Equation 4 sizes the RF and RG, resistors to set the gain of the TLV906x-Q1 to 49.5 V/V.

Equation 4. G a i n =   1   +   R F R G

Selecting RF to equal 165 kΩ and RG to equal 3.4 kΩ provides a combination that equals approximately 49.5 V/V. Figure 10-2 shows the measured transfer function of the circuit shown in Figure 10-1. Notice that the gain is only a function of the feedback and gain resistors. This gain is adjusted by varying the ratio of the resistors and the actual resistor values are determined by the impedance levels that the designer wants to establish. The impedance level determines the current drain, the effect that stray capacitance has, and a few other behaviors. There is no best impedance selection that works for every system; designers must choose an impedance that is best for the system parameters.