SBOS839M March   2017  – December 2024 TLV9061 , TLV9062 , TLV9064

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: TLV9061
    5. 5.5  Thermal Information: TLV9061S
    6. 5.6  Thermal Information: TLV9062
    7. 5.7  Thermal Information: TLV9062S
    8. 5.8  Thermal Information: TLV9064
    9. 5.9  Thermal Information: TLV9064S
    10. 5.10 Electrical Characteristics
    11. 5.11 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Rail-to-Rail Input
      2. 6.3.2 Rail-to-Rail Output
      3. 6.3.3 EMI Rejection
      4. 6.3.4 Overload Recovery
      5. 6.3.5 Shutdown Function
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Low-Side Current Sense Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Input and ESD Protection
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision L (September 2024) to Revision M (December 2024)

  • Changed TLV9061S DBV (SOT-23) pinout drawing to match the Pin Functions tableGo

Changes from Revision K (July 2024) to Revision L (September 2024)

  • Deleted package preview note from TLV9062S (YCK, DSBGA) package in Device Information table Go

Changes from Revision J (September 2019) to Revision K (July 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Device Information tableGo
  • Added package preview note for TLV9062S (YCK, DSBGA) package in Device Information table Go
  • Added YCK packages to the Device Comparison tableGo
  • Added TLV9062S YCK (DSBGA) pinout drawing to Pin Configuration and Functions sectionGo

Changes from Revision I (May 2019) to Revision J (September 2019)

  • Deleted TLV9062IDDFR (SOT-23, 8) package preview notations throughout data sheetGo
  • Added industry standard package names to Device Comparison Table Go
  • Added note to packages with thermal pads, specifying that the thermal pads need to be connected to V–Go
  • Added link to Shutdown Function section in SHDN pin function rowsGo
  • Added EMI Rejection section to the Feature Description sectionGo
  • Changed Shutdown Function section to add more clarification Go

Changes from Revision H (April 2019) to Revision I (May 2019)

  • Added DDF (SOT-23) thermal information to replace TBDsGo

Changes from Revision G (December 2018) to Revision H (April 2019)

  • Added (SOT-23, 8) information to Device Information Go
  • Added DDF package column to Device Comparison Table Go
  • Added DDF (SOT-23) package, to Pin Functions Go
  • Added DDF (SOT-23) package to Thermal Information Go

Changes from Revision F (September 2018) to Revision G (December 2018)

  • Changed TLV9064 RUC package name from: (WQFN, 14) to: (X2QFN, 14) in Device Information tableGo
  • Added RUC (X2QFN) package, pinout information to Pin Functions: TLV9064 tableGo
  • Added TLV9064 RUC (X2QFN) pinout drawing to Pin Configuration and Functions sectionGo
  • Added RUC (X2QFN) to Thermal Information: TLV9064 tableGo

Changes from Revision E (July 2018) to Revision F (September 2018)

  • Deleted Shutdown part numbers from data sheet header Go
  • Deleted (X2QFN, 10) package from TLV9062 Device Information tableGo
  • Added references to shutdown part numbers in Description section Go
  • Changed TLV906xS series to TLV906xS family throughout data sheetGo
  • Added Shutdown devices to Device Comparison Table Go
  • Changed pin namings for all pinout drawings to reflect updated nomenclature Go
  • Added TLV9061S Thermal Information TableGo
  • Added TLV9064S Thermal Information TableGo
  • Deleted Partial Shutdown Amplifier Enable TimeGo
  • Added clarification on selecting resistors for a current sensing application in the Typical Applications Section Go
  • Changed wording of third bullet in Layout GuidelinesGo

Changes from Revision D (June 2018) to Revision E (July 2018)

  • Added TLV9061S device to Device Information tableGo
  • Added TLV9064S device to Device Information tableGo
  • Added RUC and RUG packages to the Device Comparison tableGo
  • Added TLV9061S DBV (SOT-23) pinout drawing to Pin Configuration and Functions sectionGo
  • Added TLV9061S DBV (SOT-23) package, pinout information to Pin Functions: TLV9061S tableGo
  • Added TLV9062S RUG (VSSOP) package, pinout drawing to Pin Configuration and Functions sectionGo
  • Added TLV9064 RTE pinout information to Pin Functions: TLV9064 tableGo
  • Added TLV9064S RTE (WQFN) pinout drawing to Pin Configuration and Functions section Go
  • Added TLV9062S RUG (VSSOP) package, pinout information to Pin Functions: TLV9062S tableGo
  • Added TLV9064 RTE (WQFN) pinout drawing to Pin Configuration and Functions section Go

Changes from Revision C (March 2018) to Revision D (June 2018)

  • Added shutdown suffix to "TLV906x" to document titleGo
  • Added "Shutdown Version" bullet to Features list Go
  • Added TLV9062S device to Device Information tableGo
  • Added shutdown text to Description (continued) sectionGo
  • Added "(VS = [V+] – [V–]) supply voltage parameter in Absolute Maximum Ratings tableGo
  • Added "input voltage range" and "output voltage range" parameters and values to Recommended Operating Conditions tableGo
  • Added shutdown pin recommended operating conditions in Recommended Operating Conditions tableGo
  • Added "TA" symbol to "specified temperature" parameter to Recommended Operating Conditions table Go
  • Added Thermal Information: TLV9062S thermal table dataGo
  • Added shutdown section to Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8V to 5.5V tableGo
  • Added Shutdown Function section Go

Changes from Revision B (October 2017) to Revision C (March 2018)

  • Changed device status from Production Data/Mixed Status to Production Data Go
  • Deleted package preview note from TLV9061 (DPW, X2SON) package in Device Information table Go
  • Deleted package, preview note from TLV9061 DPW (X2SON) package, pinout drawing Go
  • Changed formatting of ESD Ratings table to show different results for all packages Go
  • Deleted package preview note from DPW (X2SON) package in Thermal Information: TLV9061 table Go
  • Deleted package preview note from DPW (X2SON) package in Thermal Information: TLV9061 table Go

Changes from Revision A (June 2017) to Revision B (October 2017)

  • Added 8-pin PW package, to Pin Configuration and Functions section Go
  • Added DSG (WSON) package to Thermal Information tableGo
  • Added PW (TSSOP) to TLV9062 Thermal Information table Go
  • Changed maximum input offset voltage value from ±1.6mV to 2mVGo
  • Changed maximum input offset voltage value from ±1.5 to ±1.6mVGo
  • Changed minimum common-mode rejection ratio input voltage range from 86dB to 80dB Go
  • Changed typical input current noise density value from 10 to 23fA/√ Hz Go
  • Changed THD + N test conditions from VS = 5V to VS = 5.5VGo
  • Added VCM = 2.5V test condition to THD + N parameter in Electrical Characteristics table Go
  • Added maximum output voltage swing value from 25mV to 60mVGo
  • Changed maximum output voltage swing value from 15mV to 20mV Go

Changes from Revision * (March 2017) to Revision A (June 2017)

  • Changed device status from Advance Information to Production Data Go