SNIS217C december   2020  – may 2023 TMP139

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-Up Sequence
      2. 7.3.2 Power-Down and Device Reset
      3. 7.3.3 Temperature Result and Limits
      4. 7.3.4 Bus Reset
      5. 7.3.5 Interrupt Generation
      6. 7.3.6 Parity Error Check
      7. 7.3.7 Packet Error Check
    4. 7.4 Device Functional Modes
      1. 7.4.1 Conversion Mode
      2. 7.4.2 Serial Address
      3. 7.4.3 I2C Mode Operation
        1. 7.4.3.1 Host I2C Write Operation
        2. 7.4.3.2 Host I2C Read Operation
        3. 7.4.3.3 Host I2C Read Operation in Default Read Address Pointer Mode
        4. 7.4.3.4 Switching from I2C Mode to I3C Basic Mode
      4. 7.4.4 I3C Basic Mode Operation
        1. 7.4.4.1 Host I3C Write Operation without PEC
        2. 7.4.4.2 Host I3C Write Operation with PEC
        3. 7.4.4.3 Host I3C Read Operation without PEC
        4. 7.4.4.4 Host I3C Read Operation with PEC
        5. 7.4.4.5 Host I3C Read Operation in Default Read Address Pointer Mode
      5. 7.4.5 In Band Interrupt
        1. 7.4.5.1 In Band Interrupt Arbitration Rules
        2. 7.4.5.2 In Band Interrupt Bus Transaction
      6. 7.4.6 Common Command Codes Support
        1. 7.4.6.1 ENEC CCC
        2. 7.4.6.2 DISEC CCC
        3. 7.4.6.3 RSTDAA CCC
        4. 7.4.6.4 SETAASA CCC
        5. 7.4.6.5 GETSTATUS CCC
        6. 7.4.6.6 DEVCAP CCC
        7. 7.4.6.7 SETHID CCC
        8. 7.4.6.8 DEVCTRL CCC
      7. 7.4.7 I/O Operation
      8. 7.4.8 Timing Diagrams
    5. 7.5 Programming
      1. 7.5.1 Enabling Interrupt Mechanism
      2. 7.5.2 Clearing Interrupt
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YAH|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (November 2022) to Revision C (May 2023)

  • Changed the reset value of MR2 register from 04h to 06hGo
  • Changed the reset value for the MR2 DEV_REV_MINOR[2:0] bit from 010 to 011Go

Changes from Revision A (February 2022) to Revision B (November 2022)

  • Changed Device Information table to Package Information Go
  • Updated typical IQ from 4.7 µA to 8.3 µAGo
  • Updated max IQ from 10 µA to 12.4 µA Go
  • Updated test condition for IDDR and typical currentGo
  • Updated test condition for IDDW and typical currentGo
  • Updated typical active current from 92 µA to 99 µA Go
  • Updated typical standby current from 0.6 µA to 4 µAGo
  • Updated max standby current from 4 µA to 6.5 µA Go
  • Updated tSUSTA in I3C mode from 19.2 ns to 12 ns to match JESD302-1Go
  • Updated tHDSTA in I3C mode from 38.4 ns to 30 ns to match JESD302-1Go
  • Updated tSUSTO in I3C mode from 19.2 ns to 12 ns to match JESD302-1Go
  • Changed Figure 6-8 through Figure 6-12 Go
  • Moved the Power Supply Recommendationsand Layout sections to the Application and Implementation sectionGo

Changes from Revision * (December 2020) to Revision A (February 2022)

  • Changed the reset value of MR2 register from 02h to 04hGo
  • Changed the DEF_ADDR_POINT_EN bit descriptionGo
  • Changed the address in the MR7 register descriptionGo