SBOS466B December   2009  – December 2018 TMP20

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Block Diagram
    2.     Device Quiescent Current Over Temperature
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Transfer Function
        1. 7.3.1.1 Example 1
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Drive and Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 TINA-TI (Free Download Software)
        1. 11.1.1.1 Using TINA-TI SPICE-Based Analog Simulation Program with the TMP20
      2. 11.1.2 Development Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (October 2017) to B Revision

  • Changed the y-axis unit of Device Quiescent Current Over Temperature graph from: mA to: µAGo
  • Changed the y-axis unit of Device Quiescent Current vs Temperature graph from: mA to: µAGo
  • Changed the y-axis unit of Device Quiescent Current vs Temperature graph from: mA to: µAGo
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from * Revision (December 2009) to A Revision

  • Updated data sheet formatting and content to latest TIS documentation and translation standards Go
  • Added body size information to Device Information section Go
  • Updated Device Block DiagramGo
  • Updated Device Quiescent Current Over TemperatureGo
  • Reformatted Absolute Maximum Ratings table Go
  • Changed Thermal Information table and added thermal information Go
  • Changed minimum temperature sensitivity value from –11.4 mV/°C to –12.2 mV/°C in Electrical Characteristics tableGo
  • Changed maximum temperature sensitivity value from –12.2 mV/°C to –11.4 mV/°C in Electrical Characteristics tableGo
  • Updated Figure 1Go
  • Updated Figure 3Go
  • Updated Figure 7Go
  • Added Functional Block diagram, key graphics on front page, typical application schematic, application curves, and updated layout images Go
  • Reformatted equations in Transfer Function section Go
  • Corrected Equation 2 in Transfer Function section Go
  • Added copyright notices to Figure 15 and Figure 16Go