SCDS431D October   2020  – July 2024 TMUX6211 , TMUX6212 , TMUX6213

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Source or Drain Continuous Current
    6. 6.6  ±15 V Dual Supply: Electrical Characteristics 
    7. 6.7  ±15 V Dual Supply: Switching Characteristics 
    8. 6.8  36 V Single Supply: Electrical Characteristics 
    9. 6.9  36 V Single Supply: Switching Characteristics 
    10. 6.10 12 V Single Supply: Electrical Characteristics 
    11. 6.11 12 V Single Supply: Switching Characteristics 
    12. 6.12 ±5 V Dual Supply: Electrical Characteristics 
    13. 6.13 ±5 V Dual Supply: Switching Characteristics 
    14. 6.14 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  tON and tOFF Time
    5. 7.5  tON (VDD) Time
    6. 7.6  Propagation Delay
    7. 7.7  Charge Injection
    8. 7.8  Off Isolation
    9. 7.9  Channel-to-Channel Crosstalk
    10. 7.10 Bandwidth
    11. 7.11 THD + Noise
    12. 7.12 Power Supply Rejection Ratio (PSRR)
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Integrated Pull-Down Resistor on Logic Pins
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Latch-Up Immune
      7. 8.3.7 Ultra-Low Charge Injection
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision C (July 2021) to Revision D (July 2024)

  • Updated HBM ESD details for PW and RUM packagesGo
  • Updated IIH max specification from 1.2uA to 2uAGo

Changes from Revision B (April 2021) to Revision C (July 2021)

  • Added the high current support for the TSSOP packageGo
  • Changed the status of the QFN package for TMUX621x from: preview to: active Go
  • Added ESD detail for RUM packageGo
  • Changed THD+N typical for 12V supplyGo
  • Added the Integrated Pull-Down Resistor on Logic Pins sectionGo
  • Updated the Ultra-Low Charge Injection sectionGo
  • Updated the TMUX621x Layout Example FigureGo

Changes from Revision A (January 2021) to Revision B (April 2021)

  • Added thermal information for QFN packageGo
  • Updated IDC specs for TSSOP package in Source or Drain Continuous Current table Go
  • Added IDC specs for QFN package in Source or Drain Continuous Current table Go
  • Included Break-before-make time delay for TMUX6213Go
  • Updated VDD rise time value from 100ns to 1µs in TON(VDD) test conditionGo
  • Updated CL value from 1nF to 100pF in Charge Injection test conditionGo

Changes from Revision * (October 2020) to Revision A (January 2021)

  • Changed status of data sheet from Advanced Information to Production Data Go