SNVSCC2F November   2022  – July 2024 TPS389C03-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I2C
      2. 7.3.2  Maskable Interrupt (AMSK)
      3. 7.3.3  VDD
      4. 7.3.4  MON
      5. 7.3.5  NRST
      6. 7.3.6  NIRQ
      7. 7.3.7  ADC
      8. 7.3.8  Packet Error Checking (PEC)
      9. 7.3.9  Q&A Watchdog
        1. 7.3.9.1 Question and Token Generation
        2. 7.3.9.2 Q&A Watchdog Open and Close Window Delay
        3. 7.3.9.3 Q&A Watchdog Status Register
        4. 7.3.9.4 Q&A Watchdog Timing
        5. 7.3.9.5 Q&A Watchdog State Machine and Test Program
      10. 7.3.10 Error Signal Monitoring (ESM)
        1. 7.3.10.1 ESM Timing
      11. 7.3.11 Register Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Built-In Self Test and Configuration Load
        1. 7.4.1.1 Notes on BIST Execution
      2. 7.4.2 TPS389C03-Q1 Power ON
  9. 8 Register Maps
    1. 8.1 Registers Overview
      1. 8.1.1 BANK0 Registers
      2. 8.1.2 BANK1 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Guidelines
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Documentation Support
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision E (February 2024) to Revision F (June 2024)

  • Updated WDO delays typGo
  • Removed THD;DAT max limits to confirm to I2C standardsGo
  • Addition of Register Protection Feature DescriptionGo
  • Clarification of BIST ESM and Watchdog coverage Go

Changes from Revision D (October 2023) to Revision E (February 2024)

  • Addition of device summary tables Table 4-1, Table 4-2, and Table 4-3 Go
  • Specify device behavior when fault reporting output is un-mappedGo
  • Specificy device behavior when fault reporting output is un-mappedGo
  • Additional clarification regarding the operation of PECGo
  • Clarify watchdog window delay accuracyGo
  • Clarification of WDO signal timingGo
  • Specificy device behavior when fault reporting output is un-mappedGo
  • Clarification of WDO signal timingGo
  • Clarification of WDO timingGo
  • Clarification of mapped error reportingGo

Changes from Revision C (May 2023) to Revision D (October 2023)

  • Production Data ReleaseGo