4 Revision History
Changes from A Revision (April 2014) to B Revision
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Changed package SON To: WSON in the Features and throughout the data sheetGo
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Changed PowerPAD™ To Thermal Pad in the Features and throughout the data sheetGo
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Added the WEBENCH information in the Features, Detailed Design Procedure, and Device Support sectionsGo
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Added SW, 5-ns Transient to the Absolute Maximum RatingsGo
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Moved Storage temperature to the Absolute Maximum Ratings table Go
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Changed the Handling Ratings table to the ESD Ratings table Go
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Changed Equation 10 and Equation 11 Go
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Changed Equation 30 Go
Changes from * Revision (April 2014) to A Revision
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Changed device status from Product Preview to Production Data Go