SLVSFS3B September   2020  – July 2021 TPS62868 , TPS62869

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C InterfaceTiming Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Forced PWM Mode
      3. 8.3.3 100% Duty Cycle Mode Operation
      4. 8.3.4 Start-up
      5. 8.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
      6. 8.3.6 Undervoltage Lockout (UVLO)
      7. 8.3.7 Thermal Warning and Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable (EN)
      2. 8.4.2 Output Discharge
      3. 8.4.3 Start-Up Output Voltage and I2C Target Address Selection
        1. 8.4.3.1 TPS6286xxA Devices
        2. 8.4.3.2 TPS6286xxxC Devices
      4. 8.4.4 Select Output Voltage Registers (VID)
      5. 8.4.5 Power Good ( PG)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
    6. 8.6 Register Map
      1. 8.6.1 Target Address Byte
      2. 8.6.2 Register Address Byte
      3. 8.6.3 VOUT Register 1
      4. 8.6.4 VOUT Register 2
      5. 8.6.5 CONTROL Register
      6. 8.6.6 STATUS Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting The Output Voltage
        2. 9.2.2.2 Output Filter Design
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application – TPS6286x0A and TPS6286x0xC Devices
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Setting the Output Voltage
        2. 9.3.2.2 Output Filter Design
        3. 9.3.2.3 Inductor Selection
        4. 9.3.2.4 Capacitor Selection
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Trademarks
    6. 12.6 Glossary
    7. 12.7 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Recommended Operating Conditions

Over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 2.4 5.5 V
tF_VIN Falling transition time at VIN(1) 10 mV/µs
IOUT Output current, TPS62868 (2) 0 4 A
Output current, TPS62869 (3) 0 6
L Output inductor TPS628680x, TPS628690x 110 nH
TPS628681x, TPS628682x, TPS628691x, TPS628692x 220
TJ Junction temperature -40 125 °C
(1) The falling slew rate of VIN should be limited if VIN goes below VUVLO.
(2) Lifetime is reduced when operating continuously at 4-A output current and the junction temperature is higher than 105 °C.
(3) Lifetime is reduced when operating continuously at 6-A output current and the junction temperature is higher than 85 °C.