SLVS916I July   2010  – October 2019 TPS63020 , TPS63021

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Dynamic Voltage Positioning
      2. 7.3.2 Dynamic Current Limit
      3. 7.3.3 Device Enable
      4. 7.3.4 Power Good
      5. 7.3.5 Overvoltage Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-start and Short Circuit Protection
      2. 7.4.2 Buck-Boost Operation
      3. 7.4.3 Control Loop
      4. 7.4.4 Power Save Mode and Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bypass Capacitor
      3. 8.2.3 Setting The Output Voltage
      4. 8.2.4 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Improved Transient Response for 2 A Load Current
      2. 8.3.2 Supercapacitor Backup Power Supply With Active Cell Balancing
      3. 8.3.3 Low-Power TEC Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Device Support
      1. 11.2.1 Custom Design with WEBENCH Tools
      2. 11.2.2 Third-Party Products Disclaimer
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Related Links
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

For all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator can show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. Place the input capacitor, output capacitor, and the inductor as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.

The feedback divider must be placed as close as possible to the control ground pin of the IC. To lay out the control ground, short traces are recommended as well, separation from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.