SLVS916I July   2010  – October 2019 TPS63020 , TPS63021

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Dynamic Voltage Positioning
      2. 7.3.2 Dynamic Current Limit
      3. 7.3.3 Device Enable
      4. 7.3.4 Power Good
      5. 7.3.5 Overvoltage Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-start and Short Circuit Protection
      2. 7.4.2 Buck-Boost Operation
      3. 7.4.3 Control Loop
      4. 7.4.4 Power Save Mode and Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bypass Capacitor
      3. 8.2.3 Setting The Output Voltage
      4. 8.2.4 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Improved Transient Response for 2 A Load Current
      2. 8.3.2 Supercapacitor Backup Power Supply With Active Cell Balancing
      3. 8.3.3 Low-Power TEC Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Device Support
      1. 11.2.1 Custom Design with WEBENCH Tools
      2. 11.2.2 Third-Party Products Disclaimer
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
    4. 11.4 Related Links
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (August 2019) to I Revision

  • Changed ESD numbers to reflect latest test insightsGo
  • Changed Footnotes in order to reflect wording of latest JEP155 and JEP157 specificationsGo
  • Changed VFB naming and description for better readabilityGo

Changes from G Revision (March 2019) to H Revision

Changes from F Revision (March 2019) to G Revision

  • Changed the Simplified Schematic, removed the connection from VINA to VIN Go
  • Changed Figure 7, removed the connection from VINA to VIN Go
  • Changed Figure 28, removed the connection from VINA to VIN Go

Changes from E Revision (May 2017) to F Revision

  • Updated Features and Applications on the 1st pageGo
  • Changed the Body Size column To: Output Voltage in the Device Information table Go
  • Changed the Pin Configuration image Go
  • Changed Chapter order in Application Information .Go
  • Updated output capacitor selection section Go
  • Added Table of Typical Characteristics Curves. Go
  • Changed Figure 24 and Figure 25Go
  • Added Figure 26 and Figure 27Go
  • Changed Figure 28Go
  • Added system examples Supercapacitor Backup Power Supply With Active Cell Balancing and Low-Power TEC DriverGo

Changes from D Revision (October 2015) to E Revision

Changes from C Revision (February 2013) to D Revision

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from B Revision (August 2012) to C Revision

  • Changed Figure 7 schematic to show correct component values. Go
  • Changed Figure 28 schematic to show correct component values. Go

Changes from A Revision (December 2011) to B Revision

  • Changed the Duty cycle in step down conversion values, added MIN = 20%, deleted TYP = 30% and MAX = 40%Go

Changes from * Revision (April 2010) to A Revision