SLVSAM8D July   2013  – August 2019 TPS63050 , TPS63051

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic (WCSP)
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Good
      2. 8.3.2 Overvoltage Protection
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Soft Start
      6. 8.3.6 Short Circuit Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Loop Description
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 Adjustable Current Limit
      4. 8.4.4 Device Enable
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Output Filter Design
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Capacitor selection
          1. 9.2.2.4.1 Input Capacitor
          2. 9.2.2.4.2 Output Capacitor
        5. 9.2.2.5 Setting the Output Voltage
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example (WCSP)
    3. 11.3 Layout Example (HotRod)
    4. 11.4 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Custom Design With WEBENCH® Tools
    2. 12.2 Device Support
      1. 12.2.1 Third-Party Products Disclaimer
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (July 2015) to D Revision

  • Added Webench links to the data sheetGo
  • Changed the Pin ConfigurationsGo
  • Changed the quiescent current VIN max value From: 60 µA To: 65 µA in the Electrical CharacteristicsGo
  • Added Note: Conditions: TJ = –40°C to 85°C To the quiescent current and shutdown current in the Electrical CharacteristicsGo

Changes from B Revision (April 2015) to C Revision

  • Added new package option to FeaturesGo
  • Added VQFN package to Device Information table Go
  • Added HotRod Pin Configuration and Functions Go
  • Added Parameter Measurement Circuit for HotRod package optionGo

Changes from A Revision (February 2014) to B Revision

  • Changed Description section Go
  • Changed graphic image Go
  • Changed Ordering Information table To:Device Comparison TableGo
  • Changed "Handling Ratings" table to "ESD Rating" table and moved Tstg spec to the Absolute Maximum Ratings tableGo
  • Moved some Typical Characteristics graphs to the Application Curves section Go

Changes from * Revision (July 2013) to A Revision

  • Added Device Information and ESD Rating tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added TPS63050 device specifications and description throughout data sheet Go
  • Changed Figure 34, PCB Layout Go
  • Changed Figure 35, PCB Layout Go