SLUSD66D September   2019  – February 2021 TPS92520-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Buck Converter Switching Operation
      2. 7.3.2  Switching Frequency and Adaptive On-Time Control
      3. 7.3.3  Minimum On-Time, Off-Time, and Inductor Ripple
      4. 7.3.4  LED Current Regulation and Error Amplifier
      5. 7.3.5  Start-up Sequence
      6. 7.3.6  Analog Dimming and Forced Continuous Conduction Mode
      7. 7.3.7  External PWM Dimming and Input Undervoltage Lockout (UVLO)
      8. 7.3.8  Internal PWM Dimming
      9. 7.3.9  Shunt FET Dimming or Matrix Beam Application
      10. 7.3.10 Bias Supply
      11. 7.3.11 Bootstrap Supply
      12. 7.3.12 ADC
        1. 7.3.12.1 Input Voltage Measurement: VINx
        2. 7.3.12.2 LED Voltage Measurement: CSNx
        3. 7.3.12.3 Bias Supply Measurement: V5D
        4. 7.3.12.4 External Limp-Home Input Measurement: LHI
        5. 7.3.12.5 Junction Temperature Measurement: TEMP
      13. 7.3.13 Faults and Diagnostics
      14. 7.3.14 Output Short Circuit Fault
      15. 7.3.15 Output Open Circuit Fault
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power On Reset (POR)
      2. 7.4.2 Detect SPI Communication
      3. 7.4.3 Standalone Mode
      4. 7.4.4 Load Mode
      5. 7.4.5 Run Mode
      6. 7.4.6 Sleep Mode
      7. 7.4.7 Limp-Home Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Command Frame
      3. 7.5.3 Response Frame
        1. 7.5.3.1 Read Response Frame Format
        2. 7.5.3.2 Write Response Frame Format
        3. 7.5.3.3 Write Error/POR Frame Format
      4. 7.5.4 SPI Error
      5. 7.5.5 SPI for Multiple Slave Devices in Parallel Configuration
      6. 7.5.6 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
      1. 7.6.1 Configuration Registers
        1. 7.6.1.1 SYSCFG1 Register (address = 0x00) [reset = 0x10]
        2. 7.6.1.2 SYSCFG2 Register (address = 0x01) [reset = 0x00]
        3. 7.6.1.3 CMWTAP Register (address = 0x02) [reset = 0x08]
      2. 7.6.2 STATUS Registers
        1. 7.6.2.1 STATUS1 Register (address = 0x03)
        2. 7.6.2.2 STATUS2 Register (address = 0x04)
        3. 7.6.2.3 STATUS3 Register (address = 0x05)
      3. 7.6.3 Device Control Registers
        1. 7.6.3.1  Thermal Warning Limit (address = 0x06) [reset = 0x8A]
        2. 7.6.3.2  SLEEP Command (address = 0x07) [reset = 0x00]
        3. 7.6.3.3  CH1IADJL Control Register (address = 0x08) [reset = 0x00]
        4. 7.6.3.4  CH1IADJH Control Register (address = 0x09) [reset = 0x00]
        5. 7.6.3.5  CH2IADJL Control Register (address = 0x0A) [reset = 0x00]
        6. 7.6.3.6  CH2IADJH Control Register (address = 0x0B) [reset = 0x00]
        7. 7.6.3.7  PWMDIV Register (address = 0x0C) [reset = 0x04]
        8. 7.6.3.8  CH1PWML Register (address = 0x0D) [reset = 0x00]
        9. 7.6.3.9  CH1PWMH Register (address = 0x0E) [reset = 0x00]
        10. 7.6.3.10 CH2PWML Register (address = 0x0F) [reset = 0x00]
        11. 7.6.3.11 CH2PWMH Register (address = 0x10) [reset = 0x00]
        12. 7.6.3.12 CH1TON Register (address = 0x11) [reset = 0x07]
        13. 7.6.3.13 CH2TON Register (address = 0x12) [reset = 0x07]
      4. 7.6.4 ADC Measurements
        1. 7.6.4.1  CH1VIN Measurement (address = 0x13)
        2. 7.6.4.2  CH1VLED Measurement (address = 0x14)
        3. 7.6.4.3  CH1VLEDON Measurement (address = 0x15)
        4. 7.6.4.4  CH1VLEDOFF Measurement (address = 0x16)
        5. 7.6.4.5  CH2VIN Measurement (address = 0x17)
        6. 7.6.4.6  CH2VLED Measurement (address = 0x18)
        7. 7.6.4.7  CH2VLEDON Measurement (address = 0x19)
        8. 7.6.4.8  CH2VLEDOFF Measurement (address = 0x1A)
        9. 7.6.4.9  TEMPL Measurement (address = 0x1B)
        10. 7.6.4.10 TEMPH Measurement (address = 0x1C)
        11. 7.6.4.11 V5D Measurement (address = 0x1D)
      5. 7.6.5 Limp-Home Configuration and Command Registers
        1. 7.6.5.1  LHCFG1 Register (address = 0x1E) [reset =0x00]
        2. 7.6.5.2  LHCFG2 Register (address = 0x1F) [reset =0x00h]
        3. 7.6.5.3  LHIL Measurement (address = 0x20)
        4. 7.6.5.4  LHIH Measurement (address = 0x21)
        5. 7.6.5.5  LHIFILTL Register (address = 0x22)
        6. 7.6.5.6  LHIFILTH Register (address = 0x23)
        7. 7.6.5.7  LH1IADJL Register (address = 0x24) [reset = 0x00]
        8. 7.6.5.8  LH1IADJH Register (address = 0x25) [reset = 0x00]
        9. 7.6.5.9  LH2IADJL Register (address = 0x26) [reset = 0x00]
        10. 7.6.5.10 LH2IADJH Register (address = 0x27) [reset = 0x00]
        11. 7.6.5.11 LH1PWML Register (address = 0x28) [reset = 0x00]
        12. 7.6.5.12 LH1PWMH Register (address = 0x29) [reset = 0x00]
        13. 7.6.5.13 LH2PWML Register (address = 0x2A) [reset = 0x00]
        14. 7.6.5.14 LH2PWMH Register (address = 0x2B) [reset = 0x00]
        15. 7.6.5.15 LH1TON Register (address = 0x2C) [reset = 0x07]
        16. 7.6.5.16 LH2TON Register (address = 0x2D) [reset = 0x07]
      6. 7.6.6 RESET Register (address = 0x2E) (Write-Only)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Duty Cycle Consideration
      2. 8.1.2  Switching Frequency Selection
      3. 8.1.3  LED Current Set Point
      4. 8.1.4  Inductor Selection
      5. 8.1.5  Output Capacitor Selection
      6. 8.1.6  Input Capacitor Selection
      7. 8.1.7  Bootstrap Capacitor Selection
      8. 8.1.8  Compensation Capacitor Selection
      9. 8.1.9  Input Undervoltage Protection
      10. 8.1.10 CSN Protection Diode
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Detailed Design Procedure
          1. 8.2.1.1.1 Calculating Duty Cycle
          2. 8.2.1.1.2 Calculating Minimum On-Time and Off-Time
          3. 8.2.1.1.3 Minimum Switching Frequency
          4. 8.2.1.1.4 LED Current Set Point
          5. 8.2.1.1.5 Inductor Selection
          6. 8.2.1.1.6 Output Capacitor Selection
          7. 8.2.1.1.7 Bootstrap Capacitor Selection
          8. 8.2.1.1.8 Compensation Capacitor Selection
          9. 8.2.1.1.9 External Channel Enable and PWM dimming
      2. 8.2.2 Application Curves
    3. 8.3 Initialization Setup
      1. 8.3.1 Initialize Device without Watchdog timer
      2. 8.3.2 Initialize Device with Watchdog Timer
      3. 8.3.3 Limp-Home Mode
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout for EMI Reduction
        1. 10.1.1.1 Ground Plane
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.1 Serial Interface

The SPI bus consists of four signals:

  • SSN
  • SCK
  • MOSI
  • MISO

The SSN, SCK, and MOSI pins are TTL inputs into the TPS92520-Q1 while the MISO pin is an open-drain output. The SPI bus can be configured for both star-connect and daisy-chain network.

A bus transaction is initiated by an MCU on a falling edge of SSN. While SSN is low, the input data present on the MOSI pin is sampled on the rising edge of SCK with the MS-bit first. The output data is asserted on the MISO pin at the falling edge of the SCK. Figure 7-14 shows the data transition and sampling edges of SCK.

GUID-709D2BA1-1A6F-46F8-9ECD-180037A5D6F1-low.gifFigure 7-14 SPI Data Format

A valid transfer requires a non-zero integer multiple of 16 SCK cycles (that is 16, 32, 48, and so forth). If SSN is pulsed low and no SCK pulses are issued before SSN rises, a SPI error is reported. Similarly, if SSN is raised before the 16th rising edge of SCK, the transfer is aborted and a SPI error is reported. If SSN is held low after the 16th falling edge of SCK and additional SCK edges occur, the data continues to flow through the TP92520-Q1 shift register and out of the MISO pin. When SSN transitions from low to high, the internal digital block decodes the most recent 16 bits that were received prior to the SSN rising edge.

SSN must transition to high only after a multiple of 16 SCK cycles for a transaction to be valid. Otherwise a SPI error is reported. In the case of a write transaction, the TPS92520-Q1 logic performs the requested operation when SSN transitions high as long as there was no SPI error. In the case of a read transaction, the read data is transferred during the next frame, regardless of whether an SPI error has occurred.

GUID-6664EEB7-4AF3-4435-AB49-F98B1DCAAAE3-low.gifFigure 7-15 SPI Command and Response Sequence

The data bit on MOSI is shifted into an internal 16-bit shift register (MS-bit first) while data is simultaneously shifted out of the MISO pin. While SSN is high (bus idle), MISO is tri-stated by the open-drain driver. While SSN is low, MISO is driven according to the 16-bit data pattern being shifted out based on the prior received command. To begin a transaction at the falling edge of the SSN, MISO is driven to the MS-bit of the outbound data and is updated on each subsequent falling edge of SCK.