SLLS822C July   2007  – December 2024 TRSF3221E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings, IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Resistance Characteristics
    6. 5.6  Electrical Characteristics
    7. 5.7  Electrical Characteristics, Driver
    8. 5.8  Switching Characteristics, Driver
    9. 5.9  Electrical Characteristics, Receiver
    10. 5.10 Switching Characteristics, Receiver
    11. 5.11 Electrical Characteristics, Auto-Powerdown
    12. 5.12 Switching Characteristics, Auto-Powerdown
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
      2. 8.1.2 Application Performance Plot
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Figure 8-1)
PARAMETERTEST CONDITIONS(1)MINTYP(2)MAXUNIT
IIInput leakage currentFORCEOFF, FORCEON, EN±0.01±1μA
ICCSupply current
(TA = 25°C)		Auto-powerdown disabledNo load,
FORCEOFF and FORCEON at VCC		0.31mA
Powered offNo load, FORCEOFF at GND110μA
Auto-powerdown enabledNo load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded		110
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.