SLLS822B July   2007  – July 2021 TRSF3221E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Resistance Characteristics
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics, Driver
    8. 6.8  Switching Characteristics, Driver
    9. 6.9  Electrical Characteristics, Receiver
    10. 6.10 Switching Characteristics, Receiver
    11. 6.11 Electrical Characteristics, Auto-Powerdown
    12. 6.12 Switching Characteristics, Auto-Powerdown
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Design Requirements
        2. 9.1.1.2 Detailed Design Procedure
      2. 9.1.2 Application Performance Plot
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Switching Characteristics, Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Figure 9-1)
PARAMETER TEST CONDITIONS(1) MIN TYP(2) MAX UNIT
Maximum data rate
(see Figure 7-1 )		 RL = 3 kΩ CL = 1000 pF 250 kbit/s
CL = 250 pF, VCC = 3 V to 4.5 V 1000
CL = 1000 pF, VCC = 4.5 V to 5.5 V 1000
tsk(p) Pulse skew(3) CL = 250 pF RL = 3 kΩFigure 7-2

RGT Package

25

 ns
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 7-2

DB or PW package

100
SR(tr) Slew rate,
transition region
(see Figure 7-1)		 VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF 18 150 V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.