SCES643I November   2006  – December 2024 TXB0108

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: VCCA = 1.2 V
    7. 5.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 5.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 5.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 5.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 5.11 Switching Characteristics: VCCA = 1.2 V
    12. 5.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 5.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 5.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 5.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 5.16 Operating Characteristics
    17. 5.17 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Addendum
      1. 13.1.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZXY|20
  • NME|20
  • YZP|20
  • DQS|20
  • PW|20
  • RGY|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision H (August 2020) to Revision I (December 2024)

  • Added RUK package option to Device Information tableGo

Changes from Revision G (December 2018) to Revision H (August 2020)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Added NME package option to Device Information tableGo
  • Added NME package to Pin Assignments tableGo
  • Added NME package to Thermal Information tableGo

Changes from Revision F (November 2014) to Revision G (December 2018)

  • Added pinout image for the ZYPR2 package option Go
  • Added text string 'GRID LOCATOR' to Pin Functions table YZP column to clarify pin location from 'Signal Name' Go

Changes from Revision E (April 2012) to Revision F (October 2014)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed VOLA value 0.9 to 0.3 Go

Changes from Revision D (September 2011) to Revision E (April 2012)

  • Added notes to pin out graphics.Go

Changes from Revision C (August 2011) to Revision D (September 2011)

  • Added ±8-kV Human-Body Model (A114-B) (YZP Package Only) to FeaturesGo